IP Library Granted Patent US 8,061,826
Granted Patent B2
US 8,061,826 · App. 12/183,561 · Granted Nov 22, 2011

Methods and devices for remanufacturing an imaging cartridge

Assignee: Static Control Components, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,061,826
App. No.
12/183,561
Granted
Nov 22, 2011
Kind
B2
Abstract

The present application is directed to methods and devices for remanufacturing imaging cartridges. An installation handle for positioning an electronic circuit on the imaging cartridge includes a first end, and an adhesive is releasably attached to the first end. The installation handle is adapted for positioning an electronic circuit on a surface of the imaging cartridge while the electronic circuit is releasably secured to the installation handle by the adhesive.

Claims (40)

1. A device for remanufacturing an imaging cartridge, the device comprising:

an installation handle having a first end; and

an adhesive releasably attached to the first end of the installation handle;

wherein the installation handle is adapted for positioning an electronic circuit on a surface of the imaging cartridge while the electronic circuit is releasably secured to the installation handle by the adhesive.

2. The device of claim 1 , further comprising a release liner releasably attached to the adhesive.

3. The device of claim 2 , wherein the release liner extends beyond the adhesive toward a second end of the installation handle, the second end opposite the first end.

4. The device of claim 3 , wherein a length of the release liner is less than a length of the installation handle.

5. The device of claim 2 , wherein the adhesive is positioned between and in contact with both the installation handle and the release liner.

6. The device of claim 2 , wherein the adhesive force between the adhesive and the release liner is less than the adhesive force between the adhesive and the installation handle.

7. The device of claim 2 , wherein a width of each of the installation handle, the adhesive, and the release liner are approximately the same.

8. The device of claim 1 , wherein the adhesive is a pressure sensitive adhesive.

9. The device of claim 1 , wherein the installation handle comprises a second end adapted to be grasped to facilitate positioning the electronic circuit on the surface of the imaging cartridge.

10. The device of claim 1 , wherein the adhesive force between the adhesive and the installation handle is less than the adhesive force between the adhesive and the electronic circuit when the electronic circuit is attached to the adhesive.

11. A device for remanufacturing an imaging cartridge, the device comprising:

an installation handle having a first end;

an adhesive releasably attached to the first end of the installation handle; and

a release liner releasably attached to the adhesive such that the adhesive is positioned between and in contact with both the installation handle and the release liner;

wherein the installation handle is adapted for positioning an electronic circuit on a surface of the imaging cartridge while the electronic circuit is releasably secured to the installation handle by the adhesive.

12. A method for remanufacturing an imaging cartridge, comprising:

providing the imaging cartridge;

releasably attaching an electronic circuit to an installation handle;

using the installation handle to position the electronic circuit on a surface of the imaging cartridge, and

securing the electronic circuit to the surface of the imaging cartridge.

13. The method of claim 12 , wherein releasably attaching the electronic circuit to the installation handle comprises releasably attaching the electronic circuit to an adhesive on the installation handle.

14. The method of claim 13 , further comprising removing a release liner from the adhesive prior to releasably attaching the electronic circuit to the adhesive.

15. The method of claim 13 , wherein releasably attaching the electronic circuit to the adhesive comprises releasably attaching the electronic circuit to the adhesive position at a first end of the installation handle.

16. The method of claim 12 , further comprising removing an existing electronic circuit from the surface of the imaging cartridge prior to positioning the electronic circuit on the surface of the imaging cartridge.

17. The method of claim 12 , wherein securing the electronic circuit to the surface of the imaging cartridge comprises removing the installation handle from the electronic circuit such that the adhesive is transferred from the installation handle to the electronic circuit.

18. The method of claim 17 , wherein securing the electronic circuit to the surface of the imaging cartridge comprises applying a force to the electronic circuit, thereby pressing the adhesive into contact with both the electronic circuit and the surface of the imaging cartridge.

19. The method of claim 12 , wherein using the installation handle to position the electronic circuit on the surface of the imaging cartridge comprises holding the installation handle by an adhesive-free end spaced apart from the adhesive, and directing the electronic circuit to a position on the surface of the imaging cartridge.

20. A method for remanufacturing an imaging cartridge, comprising:

providing the imaging cartridge comprising an existing electronic circuit secured to a surface of the imaging cartridge;

removing the existing electronic circuit;

releasably attaching a replacement electronic circuit to an installation handle;

using the installation handle to position the replacement electronic circuit on the surface of the imaging cartridge; and

securing the replacement electronic circuit to the surface of the imaging cartridge.

21. The method of claim 20 , wherein releasably attaching the replacement electronic circuit to the installation handle comprises releasably attaching the replacement electronic circuit to an adhesive on the installation handle.

22. The method of claim 21 , further comprising removing a release liner from the adhesive prior to releasably attaching the replacement electronic circuit to the adhesive.

23. The method of claim 20 , wherein securing the replacement electronic circuit to the surface of the imaging cartridge comprises removing the installation handle from the replacement electronic circuit such that the adhesive is transferred from the installation handle to the replacement electronic circuit.

24. The method of claim 23 , wherein securing the replacement electronic circuit to the surface of the imaging cartridge comprises applying a force to the replacement electronic circuit, thereby pressing the adhesive between the replacement electronic circuit and the surface of the imaging cartridge.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2024
From: BANK OF AMERICA, N.A.
To: STATIC CONTROL COMPONENTS, INC.; SC COMPONENTS CANADA, INC.; LEE AVENUE PROPERTIES, INC.; SANTRONICS, INC.
Reel/Frame 066782/0781 →
SECURITY INTEREST Recorded Dec 23, 2016
From: STATIC CONTROL COMPONENTS, INC.; SANTRONICS, INC.; SC COMPONENTS CANADA, INC.; LEE AVENUE PROPERTIES, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 041182/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2008
From: LEWIS, LAWERENCE DALE; WILLIAMS, JAMES R.; SZABO, GLENN L.; HUCK, DONALD R.; CAUSEY, ANTHONY D.; MILLER, BILLY W.
To: STATIC CONTROL COMPONENTS, INC.
Reel/Frame 021426/0705 →
Continuity (1)
Related Publication 20100026767A1 · Feb 4, 2010