Lead frame package
View Patent ↗A lead frame package is disclosed where transmission signals are coupled into a die from a pair of lead frames through bonding wires that are separated by no more than three times a diameter of one of the bonding wires. In some embodiments, pairs of lead frames carrying differential transmission signals can be shielded by adjacent pairs of ground and power leads that are coupled into the die through bonding wires that are also separated by no more than three times a diameter of one of the bonding wires.
1. A lead frame package, comprising:
a first pair of lead frames configured to carry transmission signals and coupled to a first pair of die pads by a first pair of bond wires that are separated by no more than three times a diameter of one of the first pair of bond wires;
a second pair of lead frames, the second pair of lead frames configured to carry a ground/power pair and coupled to a second pair of die pads, which are adjacent to the first pair of die pads, by a second pair of bond wires that are separated by no more than three times a diameter of one of the second pair of bond wires; and
a first ground die pad positioned between the first pair of die pads and the second pair of die pads and down bonded to a first ground metallization by a first ground bond wire.
2. The lead frame package of claim 1 , wherein the transmission signals are serial receive or transmit differential signals.
3. The lead frame package of claim 2 , further including a third pair of lead frames, the third pair of lead frames configured to carry a ground/power pair and coupled to a third pair of die pads, which are adjacent to the first pair of die pads opposite the second pair of die pads, by a third pair of bond wires that are separated by no more than three times a diameter of one of the third pair of bond wires.
4. The lead frame package of claim 3 , including a second ground die pad positioned between the first pair of die pads and the third pair of die pads and down bonded to a second ground metallization by a second ground bond wire.
5. The lead frame package of claim 1 , wherein a ground metallization of the second pair of lead frames is coupled to a power metallization through a capacitor.
6. The lead frame package of claim 5 , wherein the ground metallization of the second pair of lead frames is coupled to a third ground metallization through a metal trace, wherein the ground metallization of the second pair of lead frames, the metal trace, and the third ground metallization are coupled to a ground plane through vias.
7. A method of coupling signals into a die, comprising:
coupling transmission signals between a first pair of lead frames and a first pair of die pads through a first pair of bond wires that are separated by no more than three times a diameter of one of the first pair of bond wires;
coupling a first power/ground pair between a second pair of lead frames and a second pair of die pads that are adjacent to the first pair of die pads through a second pair of bond wires that are separated by no more than three times a diameter of one of the second pair of bond wires; and
down bonding a first ground die pad positioned between the first pair of die pads and the second pair of die pads to a first ground metallization by a first ground bond wire.
8. The method of claim 7 , wherein the transmission signals are either transmit or receive signals.
9. The method of claim 7 , further including coupling a second power/ground pair between a third pair of lead frames and a third pair of die pads, which are adjacent to the first pair of die pads opposite the second pair of die pads, through a third pair of bond wires that are separated by no more than three times a diameter of one of the third pair of bond wires.
10. The method of claim 9 , further comprising:
down bonding a second ground die pad positioned between the first pair of die pads and the third pair of die pads to a second ground metallization by a second ground bond wire.
11. The method of claim 7 , further including coupling a ground metallization of the second pair of lead frames to a power metallization through a capacitor.
12. The method of claim 7 , further including coupling the ground metallization of the second pair of lead frames through a metal trace to a third ground metallization, wherein the ground metallization of the second pair of lead frames, the metal trace, and the third ground metallization are coupled to a ground plane through vias.
13. A lead frame package, comprising:
a first pair of lead frames configured to carry transmission signals and coupled to a first pair of die pads by a first pair of bond wires that are separated by no more than three times a diameter of one of the first pair of bond wires; and
a second pair of lead frames, the second pair of lead frames configured to carry a ground/power pair and coupled to a second pair of die pads, which are adjacent to the first pair of die pads, by a second pair of bond wires that are separated by no more than three times a diameter of one of the second pair of bond wires, wherein:
a ground metallization of the second pair of lead frames is coupled to a power metallization through a capacitor; and
the ground metallization of the second pair of lead frames is coupled to a third ground metallization through a metal trace, wherein the ground metallization of the second pair of lead frames, the metal trace, and the third ground metallization are coupled to a ground plane through vias.
14. The lead frame package of claim 13 , wherein the transmission signals are serial receive or transmit differential signals.
15. The lead frame package of claim 13 , further including a third pair of lead frames, the third pair of lead frames configured to carry a ground/power pair and coupled to a third pair of die pads, which are adjacent to the first pair of die pads opposite the second pair of die pads, by a third pair of bond wires that are separated by no more than three times a diameter of one of the third pair of bond wires.
16. The lead frame package of claim 15 , further comprising a second ground die pad positioned between the first pair of die pads and the third pair of die pads and down bonded to a second ground metallization by a second ground bond wire.