Semiconductor device and method for manufacturing same
View Patent ↗The semiconductor device, which provides reduced electric current leakage and parasitic resistance to achieve stable current gain, is provided. A first polycrystalline semiconductor layer is grown on a p-type polycrystalline silicon film exposed in a lower surface of a visor section composed of a multiple-layered film containing a p-type polycrystalline silicon film and a silicon nitride film, while growing the first semiconductor layer on a n-type collector layer, and then the first polycrystalline semiconductor layer is selectively removed. Further, a second growing operation for selectively growing the second polycrystalline semiconductor layer and the third polycrystalline semiconductor layer on the exposed portion of the p-type polycrystalline semiconductor film exposed in the lower surface of the visor section without contacting the silicon nitride film, while growing the second semiconductor layer and the third semiconductor layer, so that the third semiconductor layer is in contact with the third polycrystalline semiconductor layer.
1. A semiconductor device having a hetero bipolar transistor, said hetero bipolar transistor including:
a collector layer formed on a substrate and having a first type conductivity;
a semiconductor layer, comprising a base layer containing impurity of a second type conductivity and epitaxially grown on said collector layer and an emitter layer partially containing impurity of said first type conductivity in a region thereof, said second type conductivity being inverse of said first type conductivity;
a first insulating film provided outside of said semiconductor layer;
a visor section, provided on said first insulating film, composed of a multiple-layered film including a polycrystalline semiconductor film having a second type conductivity, a second insulating film and a third insulating film, protruding toward said interior of said semiconductor layer in a direction along a surface of said substrate, and having an edge covered with said third insulating film; and
a base coupling section, being longitudinally grown over an exposed portion of said polycrystalline semiconductor film exposed in the lower surface of said visor section, and composed of a polycrystalline semiconductor electrically coupling said polycrystalline semiconductor film with said base layer,
wherein no contact between said base coupling section and said third insulating film is created in the lower surface of said visor section.
2. The semiconductor device as set forth in claim 1 , wherein a thickness of said base coupling section is smaller than a total thickness of said base layer and said semiconductor layer.