ADHESIVE TAPE COMPOSITION FOR ELECTRONIC COMPONENTS
The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability. The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.
1 - 3 . (canceled)
4 . An adhesive tape comprising:
a heat-resistant film, and
an adhesive layer disposed on the heat-resistant film,
wherein the adhesive layer comprises 100 weight portions of acrylonitrile butadiene rubber (NBR) including 1 to 20 weight % of carboxyl functional group and 10 to 60 weight % of acrylonitrile and having an average molecular weight of 3,000 to 200,000,
5 to 300 weight portions of epoxy resin,
50 to 200 weight portions of phenol resin, and
2 to 50 weight portions of one or more hardeners selected from amine and acid anhydride hardeners.
5 . The adhesive tape of claim 4 further comprising a release film, wherein the adhesive layer is disposed between the heat-resistant film and the release film.
6 . The adhesive tape of claim 5 , wherein the release film is selected from polyethylene, polyethylene terephthalate, and polypropylene films.
7 . The adhesive tape of claim 4 , wherein the heat-resistant film includes one or more selected from the group of polyimide, polyphenylenesulfide, and polyethylene terephthalate.
8 . The adhesive tape of claim 4 , wherein the thickness of the heat-resistant film is 10 to 70 μm.
9 . The adhesive tape of claim 4 , wherein the NBR includes about 27.1 weight % of acrylonitrile and about 4.3 weight % of the carboxyl functional group.
10 . The adhesive tape of claim 4 , wherein the phenol resin comprises one or more phenol resin selected from novolac and resol groups, and wherein the softening point of the resin measured by means of the ring and ball method is 50 to 120° C.
11 . The adhesive tape of claim 4 , wherein the epoxy resin has the formula:
12 . The adhesive tape of claim 4 , wherein the phenol resin has the formula:
13 . The adhesive tape of claim 4 , wherein the adhesive layer has a viscosity of 100 to 2,000 CPS.