Methods of forming a phase change material
View Patent ↗Methods of forming a phase change material are disclosed. The method includes forming a chalcogenide compound on a substrate and simultaneously applying a bias voltage to the substrate to alter the stoichiometry of the chalcogenide compound. In another embodiment, the method includes positioning a substrate and a deposition target having a first stoichiometry in a deposition chamber. A plasma is generated in the deposition chamber to form a phase change material on the substrate. The phase change material has a stoichiometry similar to the first stoichiometry. A bias voltage is applied to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry. A phase change material, a phase change random access memory device, and a semiconductor structure are also disclosed.
1. A method of forming a phase change material, comprising:
forming a chalcogenide compound on a substrate; and
simultaneously applying a bias voltage to the substrate to alter a stoichiometry of the chalcogenide compound.
2. The method of claim 1 , wherein forming a chalcogenide compound on a substrate comprises depositing the chalcogenide compound by physical vapor deposition.
3. The method of claim 1 , wherein forming a chalcogenide compound on a substrate comprises forming the chalcogenide compound having an empirical formula of Ge x Sb 100−(x+y) Te y , wherein x ranges from approximately 5 atomic percent to approximately 60 atomic percent and y ranges from approximately 20 atomic percent to approximately 70 atomic percent.
4. The method of claim 1 , wherein forming a chalcogenide compound on a substrate comprises forming the chalcogenide compound comprising a chalcogen ion selected from the group consisting of oxygen, sulfur, selenium, tellurium, and polonium and at least one electropositive element selected from the group consisting of nitrogen, silicon, nickel, gallium, germanium, arsenic, silver, indium, tin, antimony, gold, lead, and bismuth.
5. The method of claim 4 , wherein simultaneously applying a bias voltage to the substrate comprises removing at least a portion of the chalcogen ion from the chalcogenide compound.
6. The method of claim 1 , wherein simultaneously applying a bias voltage to the substrate comprises applying a constant bias voltage to the substrate.
7. The method of claim 1 , wherein simultaneously applying a bias voltage to the substrate comprises applying a stepwise bias voltage to the substrate.
8. The method of claim 1 , wherein simultaneously applying a bias voltage to the substrate to alter the stoichiometry of the chalcogenide compound comprises producing a phase change material comprising less chalcogen ion than the chalcogenide compound.
9. A method of forming a phase change material, comprising:
positioning a substrate and a deposition target in a deposition chamber, the deposition target comprising a first stoichiometry;
generating a plasma in the deposition chamber;
forming a phase change material on the substrate, the phase change material comprising a stoichiometry substantially similar to the first stoichiometry of the deposition target; and
applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry.
10. The method of claim 9 , wherein generating a plasma in the deposition chamber comprises generating a helium, neon, argon, krypton, xenon, or radon plasma.
11. The method of claim 10 , further comprising including nitrogen in the plasma.
12. The method of claim 9 , wherein forming a phase change material on the substrate comprises forming a crystalline phase change material on the substrate.
13. The method of claim 9 , wherein applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry comprises applying a bias voltage of from approximately 25 W to approximately 200 W to the substrate.
14. The method of claim 9 , wherein applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry comprises applying the bias voltage to the substrate to convert the phase change material to a different stoichiometry than the deposition target.
15. The method of claim 9 , wherein applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry comprises forming a substantially homogeneous phase change material.
16. The method of claim 9 , wherein applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry comprises forming a heterogeneous phase change material.
17. The method of claim 9 , wherein forming a phase change material on the substrate and applying a bias voltage to the substrate to convert the stoichiometry of the phase change material to a second stoichiometry comprises substantially simultaneously forming the phase change material on the substrate and applying the bias voltage to the substrate.
18. A method of forming a phase change material, comprising:
forming a chalcogenide compound on a substrate, the chalcogenide compound comprising a different stoichiometry than a stoichiometry of a deposition target from which the chalcogenide compound is formed.
19. The method of claim 18 , wherein forming a chalcogenide compound on a substrate comprises depositing the chalcogenide compound by physical vapor deposition.
20. The method of claim 18 , wherein forming a chalcogenide compound on a substrate comprises forming the chalcogenide compound comprising a reduced chalcogen content compared to a chalcogen content of the deposition target.