Method of manufacturing a piezoelectric element
A method of manufacturing a piezoelectric element includes: forming a first base substrate having an element to be transferred; forming a second base substrate; and transferring the element to the second base substrate. The forming of the element includes forming a first electrode above a first substrate, forming a piezoelectric layer above the first electrode, forming a second electrode above the piezoelectric layer, crystallizing the piezoelectric layer, forming a dielectric layer above the second electrode, and etching the dielectric layer such that part of the second electrode is exposed and the dielectric layer has a protrusion upwardly protruding relative to the second electrode. Forming the second base substrate includes forming a third electrode above a second substrate. The transferring includes bonding the element and the second base substrate such that the second substrate is in contact with the protrusion and the second electrode is in contact with the third electrode.
1. A method of manufacturing a piezoelectric element, the method comprising:
forming a first base substrate having an element to be transferred;
forming a second base substrate; and
transferring the element to be transferred from the first base substrate to the second base substrate,
wherein the forming of the first base substrate having the element to be transferred includes:
forming a first electrode above a first substrate,
forming a piezoelectric layer above the first electrode,
forming a second electrode above the piezoelectric layer,
crystallizing the piezoelectric layer,
forming a dielectric layer at least above the second electrode, and
etching the dielectric layer such that at least a portion of the second electrode is exposed and the dielectric layer has a protrusion upwardly protruding with respect to the second electrode,
wherein the forming of the second base substrate includes forming a third electrode above a second substrate, and
wherein the transferring of the element to be transferred from the first base substrate to the second base substrate includes bonding the element and the second base substrate such that the second base substrate is in contact with the protrusion and the portion of the second electrode that is exposed is in contact with the third electrode.
2. A method of manufacturing a piezoelectric element according to claim 1 , further comprising:
forming a fourth electrode above the second substrate, and
electrically connecting the first electrode and the fourth electrode by a wiring layer,
wherein the wiring layer does not contact the second electrode and the third electrode through the dielectric layer.
3. A method of manufacturing a piezoelectric element according to claim 2 , wherein the wiring layer is formed by an ink jet method.
4. A method of manufacturing a piezoelectric element according to claim 2 , wherein the forming of the piezoelectric layer is conducted such that the first electrode is located inside the piezoelectric layer as viewed in a plan view, and a portion of the piezoelectric layer that is not interposed between the first electrode and the second electrode contacts the wiring layer.
5. A method of manufacturing a piezoelectric element according to claim 1 , wherein the etching is conducted by wet etching.
6. A method of manufacturing a piezoelectric element according to claim 1 , wherein the forming of the first base substrate further includes forming a sacrificial layer between the first substrate and the element, and the transferring of the element to be transferred from the first base substrate to the second base substrate further includes separating the first substrate.