Light emitting diode package
View Patent ↗Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.
1. A light emitting diode (LED) package comprising:
a printed circuit board (PCB);
a first conductive structure;
a second conductive structure comprising at least two separated parts separate from the first conductive structure, wherein the first conductive structure and the second conductive structure are attached to the PCB; and
an LED chip that is mounted on the first conductive structure and is electrically connected to the PCB through the second conductive structure, the LED chip has an n-electrode and a p-electrode, wherein the first conductive structure being attached to the bottom surface of the LED chip, and wherein the at least two separated parts of the second conductive structure are connected to the n-electrode and the p-electrode of the LED chip.
2. The LED package according to claim 1 , wherein the LED chip is connected to the second conductive structure through wire bonding.
3. The LED package according to claim 1 further comprising:
a molding compound that packages the first and the second conductive structures and the LED chip.
4. The LED package according to claim 1 , wherein the first and the second conductive structures are composed of a silicon or aluminum structure.
5. The LED package according to claim 1 , wherein the first and the second conductive structures are made of a common material.