Mirror bit memory device applying a gate voltage alternately to gate
A semiconductor device and a method for manufacturing thereof are provided. The semiconductor device includes: an ONO film including a charge storage layer on a semiconductor substrate; a plurality of bit lines each extending inside the semiconductor substrate; a plurality of interspaces each interposed between the adjacent bit lines; a plurality of gates each provided along the bit line on the ONO film above the interspaces; and a plurality of word lines electrically coupled with the corresponding gates formed on one of the interspaces, each extending to intersect with the bit lines. The two gates adjacent with each other in a width direction of the bit line are connected to different word lines.
1. A semiconductor device comprising:
a charge storage layer formed on a semiconductor substrate;
a plurality of bit lines, each bit line of the plurality of bit lines extending inside the semiconductor substrate;
a plurality of interspaces, each interspace of the plurality of interspaces being interposed between adjacent bit lines of the plurality of bit lines;
a plurality of gates formed on the charge storage layer above the plurality of interspaces along a longitudinal direction of the plurality of bit lines; and
a plurality of word lines electrically coupled with the plurality of gates formed on an interspace of the plurality of interspaces, each word line of the plurality of word lines extending to intersect with the plurality of bit lines,
wherein a first gate of the plurality of gates is adjacent to a second gate of the plurality of gates in a width direction of a bit line, and the first gate is connected to a different word line than the second gate and wherein a word line electrically coupled with the first gate is also electrically coupled with the gate adjacent to the first gate in the width direction of the bit line at a side opposite to the first gate.
2. The semiconductor device according to claim 1 , wherein a word line electrically coupled with the first gate is also electrically coupled with a third gate of the plurality of gates, the third gate disposed in a width direction of a bit line with respect to the first gate.
3. The semiconductor device according to claim 1 , wherein a word line electrically coupled with either the first gate or the second gate is electrically coupled with the gate adjacent to the other of the first gate or the second gate in a longitudinal direction of the bit line.
4. The semiconductor device according to claim 1 , further comprising an insulating film to cover the plurality of gates, wherein, the plurality of word lines are provided on the insulating film.
5. The semiconductor device according to claim 1 , wherein an electron is stored in the charge storage layer using a hot electron effect.
6. The semiconductor device according to claim 1 , wherein the semiconductor device is of a virtual ground type with a plurality of different charge storage regions in the charge storage layer.
7. A method for manufacturing a semiconductor device, comprising:
forming a charge storage layer on a semiconductor substrate;
forming a plurality of bit lines to extend inside the semiconductor substrate;
forming a plurality of gates on the charge storage layer above a plurality of interspaces, each gate of the plurality of gates interposed between the adjacent bit lines in the plurality of bitlines along a longitudinal direction of the plurality of bit lines; and
forming a plurality of word lines electrically coupled with the plurality of gates on an interspace of the plurality of interspaces, each word line of the plurality of word lines extending to intersect with the plurality of bit lines such that adjacent gates of the plurality of gates are electrically coupled with different word lines in a width direction of the bit line,
wherein a word line electrically coupled with the second gate is also electrically coupled with the gate adjacent to the second gate in the width direction of the bit line at a side opposite to the second gate.
8. The method for manufacturing a semiconductor device according to claim 7 , wherein forming the plurality bit lines comprises:
forming a plurality of conducting films each extending on the charge storage layer; and
forming the plurality of bit lines inside the semiconductor substrate using the conducting films as a mask.
9. The method for manufacturing a semiconductor device according to claim 8 , wherein forming the plurality of gates comprises:
forming a mask layer extending to intersect with the plurality of conducting films on the conducting films; and
forming the plurality of gates as the conducting films by etching the plurality of conducting films.
10. The method for manufacturing a semiconductor device according to claim 8 , further comprising:
forming a first insulating film to cover the plurality of conducting films, the first insulating film being polished to be interposed between the plurality of conducting films prior to forming the plurality of gates;
forming a second insulating film to cover the plurality of gates, the second insulating film being polished to be interposed between the adjacent gates in a longitudinal direction of the bit line subsequent to forming the plurality of gates; and
forming a third insulating film on the first and the second insulating films.