METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE WITH SELF-ALIGNED STRESSOR AND EXTENSION REGIONS
Methods are provided for fabricating a MOS transistor having self-aligned stressor and extension regions. A method comprises forming a gate stack overlying a layer of semiconductor material and forming a spacer about sidewalls of the gate stack. The method further comprises forming cavities in the layer of semiconductor material, wherein the cavities are substantially aligned with the spacer. The method further comprises forming a stress-inducing semiconductor material in the cavities, and implanting ions of a conductivity-determining impurity type into the stress-inducing semiconductor material using the gate stack and the spacer as an implantation mask.
1 . A method for fabricating a MOS transistor, the method comprising:
forming a gate stack overlying a layer of semiconductor material;
forming a spacer about sidewalls of the gate stack;
forming cavities in the layer of semiconductor material, the cavities being substantially aligned with the spacer;
forming a stress-inducing semiconductor material in the cavities, wherein the stress-inducing semiconductor material is aligned with outward facing sides of the spacer; and
implanting ions of a first conductivity-determining impurity type into the stress-inducing semiconductor material using the gate stack and the spacer as an implantation mask.
2 . The method of claim 1 , wherein forming the spacer and forming the cavities comprises:
forming a layer of an insulating material on the gate stack and the layer of semiconductor material; and
etching the layer of the insulating material and the layer of semiconductor material to form the spacer and the cavities, wherein the spacer is formed of the insulating material.
3 . (canceled)
4 . The method of claim 2 , wherein forming a layer of an insulating material on the gate stack and the layer of semiconductor material comprises forming a layer of silicon nitride on the gate stack and the layer of semiconductor material.
5 . The method of claim 2 , wherein etching the layer of the insulating material and the layer of semiconductor material comprises anisotropically etching the layer of the insulating material and the layer of semiconductor material.
6 . The method of claim 1 , wherein forming the stress-inducing semiconductor material in the cavities comprises epitaxially growing the stress-inducing semiconductor material in the cavities.
7 . (canceled)
8 . The method of claim 1 , further comprising implanting ions of a second conductivity-determining impurity type into the layer of semiconductor material using the gate stack and the spacer as a second implantation mask to form spaced apart halo implants.
9 . The method of claim 1 , further comprising:
removing the spacer;
forming a second spacer about sidewalls of the gate stack; and
implanting ions of the first conductivity-determining impurity type into the stress-inducing semiconductor material using the gate stack and the second spacer as a second implantation mask.
10 . The method of claim 1 , further comprising forming contact regions on the stress-inducing semiconductor material.
11 . A method for fabricating a semiconductor device, the method comprising:
forming a gate stack overlying a layer of semiconductor material;
forming a layer of an insulating material on the gate stack and the layer of semiconductor material;
etching the layer of the insulating material and the layer of semiconductor material to form a spacer about sidewalls of the gate stack and cavities in the layer of semiconductor material, the cavities being self-aligned with the spacer;
forming a stress-inducing semiconductor material in the cavities, resulting in stressor regions that are self-aligned with the spacer; and
implanting ions of a conductivity-determining impurity type into the stressor regions using the gate stack and the spacer as an implantation mask.
12 . (canceled)
13 . The method of claim 11 , wherein etching the layer of the insulating material and the layer of semiconductor material comprises anisotropically etching the layer of the insulating material and the layer of semiconductor material.
14 . The method of claim 11 , wherein implanting ions of a conductivity-determining impurity type into the stressor regions comprises implanting P-type ions into the stressor regions.
15 . A method for fabricating a CMOS device, the method comprising:
providing a semiconductor device structure having a first region of semiconductor material and a second region of semiconductor material, a first gate stack overlying the first region of semiconductor material, and a second gate stack overlying the second region of semiconductor material;
masking the second region of semiconductor material; and
while the second region of semiconductor material is masked:
forming a spacer about sidewalls of the first gate stack;
forming cavities in the first region of semiconductor material, the cavities being substantially aligned with the spacer;
at least partially filling the cavities with a stress-inducing semiconductor material, resulting in the stress-inducing semiconductor material being substantially aligned with the spacer; and
implanting P-type ions into the stress-inducing semiconductor material using the first gate stack and the spacer as an implantation mask.
16 . The method of claim 15 , further comprising forming a layer of an insulating material on the first gate stack and the first region of semiconductor material, wherein forming the spacer about sidewalls of the first gate stack and forming cavities in the first region comprises etching the layer of the insulating material and the first region.
17 . The method of claim 16 , wherein etching the layer of the insulating material and the first region comprises anisotropically etching the layer of the insulating material and the first region.
18 . The method of claim 16 , wherein forming the layer of the insulating material comprises forming the layer of the insulating material having a thickness no greater than 20 nm.
19 . The method of claim 15 , further comprising:
unmasking the second region of semiconductor material;
removing the spacer;
forming offset spacers about sidewalls of the first gate stack and the second gate stack;
masking the first region of semiconductor material; and
while the first region of semiconductor material is masked, implanting n-type ions into the second region of semiconductor material using the offset spacers and the second gate stack as a second implantation mask.
20 . The method of claim 15 , further comprising:
removing the spacer;
forming a second spacer about sidewalls of the first gate stack; and
implanting P-type ions into the stress-inducing semiconductor material using the first gate stack and the second spacer as a second implantation mask.
21 . The method of claim 1 , wherein implanting ions of the first conductivity-determining impurity type into the stress-inducing semiconductor material comprises implanting ions of the first conductivity-determining impurity type into the stress-inducing semiconductor material using the gate stack and the spacer as an implantation mask prior to forming a second spacer.
22 . The method of claim 1 , wherein implanting ions of the first conductivity-determining impurity type results in ion implant boundaries that are self aligned with the spacer and the stress-inducing semiconductor material, such that the spacer controls the proximity to a channel of the MOS transistor for both the stress-inducing semiconductor material and the ion implant boundaries.
23 . The method of claim 11 , wherein implanting ions of the conductivity-determining impurity type results in source and drain extensions that are self-aligned with the stressor regions, such that the extent of the source and drain extensions depends on the diffusion rate of the ions in the stressor regions.