IP Library Granted Patent US 7,902,565
Granted Patent B2
US 7,902,565 · App. 12/195,580 · Granted Mar 8, 2011

Semiconductor light emitting device and method for manufacturing same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,902,565
App. No.
12/195,580
Granted
Mar 8, 2011
Kind
B2
Abstract

A semiconductor light emitting device includes: a laminated body including a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer; a first electrode provided on a first major surface of the laminated body and connected to the first semiconductor layer; and a second electrode provided on the first major surface of the laminated body and connected to the second semiconductor layer. The first electrode includes: a first region provided on the first semiconductor layer and including a first metal film; and a second region provided on the first semiconductor layer and including a second metal film, the second metal film having a higher reflectivity for light emitted from the light emitting layer than the first metal film and having a higher contact resistance with respect to the first semiconductor layer than the first metal film.

Claims (19)

1. A semiconductor light emitting device comprising:

a laminated body including a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer;

a first electrode provided on a first major surface of the laminated body and connected to the first semiconductor layer; and

a second electrode provided on the first major surface of the laminated body and connected to the second semiconductor layer,

wherein the first electrode includes: a first region provided on the first semiconductor layer and including a first metal film that is in direct contact with the first semiconductor layer; and a second region provided on the first semiconductor layer and including a second metal film that is in direct contact with the first semiconductor layer, the second metal film having a higher reflectivity for light emitted from the light emitting layer than the first metal film and having a higher contact resistance with respect to the first semiconductor layer than the first metal film, and

wherein the second electrode includes: a third metal film that is in direct contact with the second semiconductor layer; and a fourth metal film that is in direct contact with the second semiconductor layer, the fourth metal film having a lower reflectivity for the light emitted from the light emitting layer than the third metal film.

2. The device according to claim 1 , wherein the first region comprises a portion of the first electrode facing the second electrode.

3. The device according to claim 1 , wherein the third metal film of the second electrode is made of the same metal as the second film.

4. The device according to claim 1 , further comprising:

a first transparent conductive film provided between the first semiconductor layer and the second metal film.

5. The device according to claim 3 , further comprising:

a second transparent conductive film provided between the second semiconductor layer and the third metal film.

6. The device according to claim 1 , wherein the laminated body includes a substrate of sapphire on the side of a second major surface opposite to the first major surface.

7. The device according to claim 6 , wherein the first semiconductor layer, the light emitting layer, and the second semiconductor layer are formed on the substrate via a single-crystal aluminum nitride layer.

8. The device according to claim 7 , wherein the aluminum nitride layer includes a portion having a relatively high carbon concentration on the substrate side.

9. The device according to claim 1 , further comprising:

a first pad covering entirely the second metal film and part of the first metal film.

10. The device according to claim 1 , further comprising: a second pad covering at least part of the fourth metal film.

11. The device according to claim 1 , further comprising: a fifth metal film provided between the third metal film and the fourth metal film.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2008
From: KATSUNO, HIROSHI; OHBA, YASUO; KANEKO, KEI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 021424/0549 →