Method of manufacturing a power module
View Patent ↗A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.
1. A method of manufacturing a power module on a substrate, comprising:
providing power conversion circuitry, including:
providing a magnetic device having a magnetic core on said substrate,
placing a shielding structure with a baffle over said magnetic core to create a chamber thereabout, and
providing at least one switch on said substrate; and
depositing an encapsulant about said power conversion circuitry, said shielding structure limiting said encapsulant entering said chamber and said baffle directing said encapsulant away from said magnetic core thereby limiting an amount of said encapsulant that contacts said magnetic core within said chamber.
2. The method as recited in claim 1 further comprising allowing at least a portion of said encapsulant to exit said chamber via said shielding structure as said encapsulant cures.
3. The method as recited in claim 1 wherein said baffle is coupled to a sidewall of said shielding structure.
4. The method as recited in claim 1 wherein said shielding structure creates a partial seal about said magnetic core.
5. The method as recited in claim 1 wherein said shielding structure creates an opening between a junction of said shielding structure and said substrate.
6. The method as recited in claim 1 wherein said shielding structure is a protective cap.
7. The method as recited in claim 1 wherein said shielding structure is formed from a material selected from the group consisting of:
a ceramic material,
aluminum,
copper, and
molded plastic.
8. The method as recited in claim 1 further comprising locating a stand off on said substrate, said stand off being between said magnetic core and said substrate.
9. The method as recited in claim 1 further comprising providing electrical leads protruding from sidewalls of said substrate.
10. The method as recited in claim 1 further comprising placing at least one conductive winding about said magnetic core.
11. The method as recited in claim 1 further comprising placing at least one planar conductive winding about said magnetic core.
12. The method as recited in claim 11 further comprising providing electrical leads protruding from sidewalls of said substrate to accommodate through hole mounting or surface mounting of said magnetic device to another substrate.
13. The method as recited in claim 1 wherein said shielding structure is configured to limit an exposure of said magnetic core to said encapsulant.
14. The method as recited in claim 1 wherein said magnetic core is formed from ferrite.
15. The method as recited in claim 1 wherein said substrate is a printed wiring board.
16. The method as recited in claim 1 wherein said encapsulant is an epoxy molding compound.
17. The method as recited in claim 1 further comprising providing electrical leads protruding from opposing sidewalls of said substrate to allow said magnetic device to be mounted to another substrate.
18. The method as recited in claim 1 wherein said baffle is selected from the group consisting of:
a plate,
a wall, and
a screen.
19. The method as recited in claim 1 wherein said baffle is located on a side of said magnetic core and said shielding structure comprises another baffle located on another side of said magnetic core with respect to said baffle.
20. The method as recited in claim 1 wherein said baffle is coupled to said substrate.