Semiconductor light-emitting device, manufacturing method thereof, and lamp

1. A semiconductor light-emitting device comprising an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, and a titanium oxide-based conductive film layer laminated in this order, wherein:

a random concavo-convex surface is formed on at least a part of the surface of said titanium oxide-based conductive film layer.

2. The semiconductor light-emitting device according to claim 1 , wherein the mean distance between convex parts on said random concavo-convex surface formed on the surface of said titanium oxide-based conductive film layer, which is defined as the center-to-center distance between the convex parts, is within a range of 0.01 μm to 3 μm.

3. The semiconductor light-emitting device according to claim 2 , wherein the mean distance between convex parts on said random concavo-convex surface formed on the surface of said titanium oxide-based conductive film layer, which is defined as the center-to-center distance between the convex parts, is within a range of 0.05 μm to 1.5 μm.

4. The semiconductor light-emitting device according to claim 2 , wherein the standard deviation of the center-to-center distance between the convex parts from the mean value of the center-to-center distance between the convex parts is within a range of 10% to 80%.

5. The semiconductor light-emitting device according to claim 1 , wherein said titanium oxide-based conductive film layer is of an oxide comprising Ti and at least one element selected from the group consisting of Ta, Nb, V, Mo, W, and Sb.

6. The semiconductor light-emitting device according to claim 1 , wherein the semiconductor light-emitting device is a nitride-based semiconductor light-emitting device.

7. The semiconductor light-emitting device according to claim 6 , wherein said nitride-based semiconductor light-emitting device is a GaN-based semiconductor light-emitting device.

8. A lamp comprising the semiconductor light-emitting device according to claim 1 .

9. The semiconductor light-emitting device according to claim 1 , further comprising a photocatalytic reaction prevention layer disposed on at least a part of the random concavo-convex surface of the titanium oxide-based conductive film layer, either directly or via an intervening layer.

10. The semiconductor light-emitting device according to claim 9 , wherein a top surface and lateral surfaces of the titanium oxide-based conductive film are covered by a photocatalytic reaction prevention layer.

11. The semiconductor light-emitting device according to claim 10 , wherein the photocatalytic reaction prevention layer covers a peripheral area of a top surface of the p-type semiconductor layer.

12. The semiconductor light-emitting device according to claim 11 , wherein the photocatalytic reaction prevention layer further covers lateral faces of each of the n-type semiconductor layer, the light-emitting layer and the p-type semiconductor layer.

13. The semiconductor light-emitting device according to claim 9 , wherein a photocatalytic reaction prevention layer has a surface comprising a concavo-convex portion, which corresponds to a shape and a location of the random concavo-convex surface disposed on the surface of the underlying titanium oxide-based conductive film layer.

14. A method of manufacturing a semiconductor light-emitting device, comprising:

a step (1) of laminating, on a substrate, an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, and a titanium oxide-based conductive film layer in this order;

a step (2) of forming a mask made of fine metal particles on the surface of the titanium oxide-based conductive film layer; and

a step (3) of etching the surface of the titanium oxide-based conductive film layer from above the mask, wherein

said step (3) forms, by dry etching or wet etching, a concavo-convex surface on at least a part of the surface of the titanium oxide-based conductive film layer, and

said semiconductor light-emitting device is the semiconductor light-emitting device according to claim 1 .

15. The method of manufacturing a semiconductor light-emitting device according to claim 14 , wherein said step (2) comprises a step of forming a metal thin film on the surface of the titanium oxide-based conductive film layer and a heat treatment step following the formation of the metal thin film.

16. The method of manufacturing a semiconductor light-emitting device according to claim 14 , wherein said step (3) forms, by dry etching, a concavo-convex surface on at least a part of the surface of the titanium oxide-based conductive film layer.

17. The method of manufacturing a semiconductor light-emitting device according to claim 14 , wherein said step (3) forms, by wet etching, a concavo-convex surface on at least a part of the surface of the titanium oxide-based conductive film layer.

18. The method of manufacturing a semiconductor light-emitting device according to claim 14 , wherein the fine metal particles forming the mask are Ni or Ni alloy.

19. The method of manufacturing a semiconductor light-emitting device according to claim 14 , wherein the fine metal particles forming the mask are a low melting point metal or a low melting point alloy having a melting point within a range of 100° C. to 450° C.

20. The method of manufacturing a semiconductor light-emitting device according to claim 14 , wherein the fine metal particles forming the mask are a low melting point metal selected from the group consisting of Ni, Au, Sn, Ge, Pb, Sb, Bi, Cd, and In, or a low melting point alloy containing at least one low melting point metal selected from the group.