IP Library Granted Patent US 7,851,975
Granted Patent B2
US 7,851,975 · App. 12/202,563 · Granted Dec 14, 2010

MEMS structure with metal protection rings

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Quick Facts
Patent No.
US 7,851,975
App. No.
12/202,563
Granted
Dec 14, 2010
Kind
B2
Abstract

A microelectromechanical system (MEMS) structure and a fabricating method thereof are described. The MEMS structure includes a fixed part and a movable part. The fixed part is disposed on and connects with a substrate. The movable part including at least two first metal layers, a first protection ring and a first dielectric layer is suspended on the substrate. The first protection ring connects two adjacent first metal layers, so as to define a first enclosed space between the two adjacent first metal layers. The first dielectric layer is disposed in the enclosed space and connects the two adjacent first metal layers.

Claims (31)

1. A microelectromechanical system (MEMS) structure, comprising:

a fixed part, disposed on a substrate and connecting with the substrate; and

a movable part, suspended on the substrate and comprising:

at least two first metal layers;

a first protection ring, connecting two adjacent first metal layers, so as to define a first enclosed space between two adjacent metal layers; and

a first dielectric layer, disposed in the enclosed space and connecting two adjacent first metal layers.

2. The MEMS structure according to claim 1 , wherein the first protection ring substantially corresponds to a profile of each first metal layer.

3. The MEMS structure according to claim 1 , wherein the first protection ring comprises metal.

4. The MEMS structure according to claim 1 , wherein the fixed part comprises:

at least two second metal layers;

a second protection ring, connecting two adjacent second metal layers, so as to define a second enclosed space between two adjacent second metal layers; and

a second dielectric layer, disposed in the enclosed space and connecting two adjacent second metal layers.

5. The MEMS structure according to claim 4 , wherein the second protection ring substantially corresponds to a profile of each second metal layer.

6. The MEMS structure according to claim 4 , wherein the second protection ring comprises metal.

7. The MEMS structure according to claim 1 , further comprising a metal plug, so as to connect the fixed part and the substrate.

8. The MEMS structure according to claim 1 , wherein the MEMS structure comprises a cantilever beam, a bridge, or a membrane.

9. A microelectromechanical system (MEMS) structure, comprising:

a fixed part, disposed on a substrate; and

a suspended part, suspended on the substrate and comprising:

at least two first metal layers;

a first protection ring, connecting two adjacent first metal layers, so as to define a first enclosed space between two adjacent metal layers; and

a first dielectric layer, disposed in the enclosed space and connecting two adjacent first metal layers.

10. The MEMS structure according to claim 9 , wherein the first protection ring substantially corresponds to a profile of each first metal layer.

11. The MEMS structure according to claim 9 , wherein the first protection ring comprises metal.

12. The MEMS structure according to claim 9 , wherein the fixed part comprises:

at least two second metal layers;

a second protection ring, connecting two adjacent second metal layers, so as to define a second enclosed space between two adjacent second metal layers; and

a second dielectric layer, disposed in the enclosed space and connecting two adjacent second metal layers.

13. The MEMS structure according to claim 12 , wherein the second protection ring substantially corresponds to a profile of each second metal layer.

14. The MEMS structure according to claim 12 , wherein the second protection ring comprises metal.

15. The MEMS structure according to claim 9 , wherein the MEMS structure comprises a cantilever beam, a bridge, or a membrane.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2008
From: LANG, BANG-CHIANG; WANG, MING-I; HO, LI-HSUN; WU, HUI-MIN; CHEN, MIN; HUANG, CHIEN-HSIN; SU, TZUNG-I
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 021474/0255 →