Light emitting device package and method of manufacturing the same

1. A light emitting device package comprising:

a metal core;

an insulating layer disposed on the metal core;

a metal layer disposed on the insulating layer;

a first cavity extending through parts of the metal layer and the insulating layer to expose a top surface of the metal core;

a light emitting device directly mounted on the top surface of the metal core in the first cavity; and

a second cavity extending through parts of the metal layer and the insulating layer to expose the top surface of the metal core at a position spaced apart from the first cavity by a predetermined distance,

a conductive layer disposed on the top surface of the metal core in the second cavity, provided as a bonding material for electrically connecting the metal core to an outside circuit.

2. The light emitting device package according to claim 1 , wherein the metal core is made of aluminum.

3. The light emitting device package according to claim 1 , wherein the insulating layer is formed by anodizing treatment.

4. The light emitting device package according to claim 1 , further comprising:

a bonding wire electrically connecting the light emitting device and the metal layer placed on a position adjacent to the first cavity.

5. The light emitting device package according to claim 1 ,

wherein the conductive layer is made of any one selected from a group consisting of Au, Ag, Ni and Cu.

6. The light emitting device package according to claim 1 ,

wherein the conductive layer is composed of a metal plating layer or a metal paste.

7. The light emitting device package according to claim 1 , further comprising:

a second insulating layer and a second metal layer sequentially disposed on a bottom surface of the metal core and including a third cavity to expose the bottom surface of the metal core on a position corresponding to the first cavity.

8. The light emitting device package according to claim 1 , further comprising:

grooves disposed on a position adjacent the first cavity to expose the top surface of the metal core, the grooves extending through parts of the metal layer and the insulating layer; and

a cap coupled on an upper part of the first cavity as protrusions disposed on a circumferential portion of the cap are inserted into the grooves.

9. The light emitting device package according to claim 8 , wherein the cap is a protection cap or a lens.

10. A light emitting device package comprising:

a metal core including a first cavity composed of a lower cavity and an upper cavity;

an insulating layer disposed on a top surface of the metal core excluding the lower cavity and including an inner surface of the upper cavity;

a metal layer disposed on the insulating layer and including a first electrode and a second electrode electrically separated from each other;

a light emitting device directly mounted on the metal core in the lower cavity;

a bonding wire electrically connecting the light emitting device and the first electrode; and

a second cavity extending through parts of the metal layer and the insulating layer to expose the top surface of the metal core at a position spaced apart from the first cavity by a predetermined distance,

a conductive layer disposed on the top surface of the metal core in the second cavity, provided as a bonding metal for electrically connecting the metal core to a outside circuit.

11. The light emitting device package according to claim 10 , wherein the first electrode is placed on a position adjacent the first cavity and formed to an inner surface of the upper cavity.

12. The light emitting device package according to claim 11 , wherein the first electrode is disposed on a partial inner surface or an entire inner surface of the upper cavity.

13. The light emitting device package according to claim 10 , wherein the bonding wire is disposed at a lower height than that of a top outer surface of the metal layer disposed on the insulating layer where the first cavity is not disposed.

14. The light emitting device package according to claim 10 , further comprising:

a second insulating layer and a second metal layer sequentially formed on a bottom surface of the metal core and including a third cavity to expose the bottom surface of the metal core on a position corresponding to the first cavity.

15. The light emitting device package according to claim 10 , further comprising:

grooves formed by removing parts of the metal layer and the insulating layer on a position adjacent to the first cavity to expose the top surface of the metal core; and

a cap coupled on an upper part of the first cavity as protrusions formed on a circumferential portion of the cap are inserted into the grooves.