IP Library Granted Patent US 8,028,390
Granted Patent B2
US 8,028,390 · App. 12/215,079 · Granted Oct 4, 2011

Spring actuated clamping mechanism

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Quick Facts
Patent No.
US 8,028,390
App. No.
12/215,079
Granted
Oct 4, 2011
Kind
B2
Abstract

A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture. When the release mechanism is loosened, backer plate is forced downwardly, applying a uniform force to all electrical contacts on the printed circuit board or card to which the clamping mechanism is attached.

Claims (11)

1. A spring actuated clamping mechanism, comprising:

a) a backer plate having an upper surface and a lower surface and a first plurality of apertures along the periphery thereof, said upper surface having at least one backer plate recess formed therein, and at least one threaded, backer plate aperture formed therein;

b) a compression plate having an upper surface and a lower surface and a second plurality of apertures along the periphery thereof, each of said second plurality of apertures corresponding to each of said first plurality of apertures, said lower surface having at least one compression plate recess formed therein, and at least one compression plate aperture formed therein;

c) at least one compression spring disposed between said backer plate and said compression plate, said at least one compression spring being retained by said at least one backer plate recess and said at least one compression plate recess; and

d) a screw tension release mechanism screwed into said backer plate threaded aperture and inserted into said compression plate aperture.

2. The spring actuated clamping mechanism in accordance with claim 1 , wherein said lower surface of said backer plate is configured in one of the group: planar and convex.

3. The spring actuated clamping mechanism in accordance with claim 1 , wherein said at least one backer plate recess and said at least one compression plate recess comprises four recesses, respectively.

4. The spring actuated clamping mechanism in accordance with claim 3 , wherein said at least one compression spring comprises four compression springs, each corresponding to one of said four compression plate recesses.

5. The spring actuated clamping mechanism in accordance with claim 4 , wherein said at least one compression spring comprises four compression springs, each corresponding to one of said four backer plate recesses.

6. The spring actuated clamping mechanism in accordance with claim 1 , wherein said threaded backer plate aperture corresponds to and is aligned with said compression plate aperture.

7. The spring actuated clamping mechanism in accordance with claim 6 , further comprising a nut disposed proximate said upper surface of said compression plate and said compression aperture for retaining said screw tension release mechanism therein.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
RELEASE OF SECURITY INTEREST Recorded Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
SECURITY AGREEMENT Recorded Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
SECURITY AGREEMENT Recorded May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
ASSIGNMENT OF SECURITY AGREEMENT Recorded Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →
SECURITY AGREEMENT Recorded May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
RELEASE BY SECURED PARTY Recorded May 14, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 028230/0611 →
SECURITY AGREEMENT Recorded Dec 3, 2008
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 021912/0908 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2008
From: CHAN, BENSON (NMN); LAUFFER, MATTHEW J.
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 021186/0769 →