Light emitting device having protrusion and recess structure and method of manufacturing the same
View Patent ↗The semiconductor light emitting device having a protrusion and recess structure includes: a lower clad layer disposed on a substrate; an active layer formed on one portion of a top surface of the lower clad layer; an upper clad layer formed on the active layer; a first electrode formed on the upper clad layer; and a second electrode that is formed on a protrusion and recess structural pattern region formed on a portion of the top surface of the lower clad layer not occupied by the active layer.
1. A method of manufacturing a semiconductor light emitting device having a protrusion and recess structure, the method comprising:
forming a lower clad layer on a substrate;
forming an active layer and an upper clad layer on the lower clad layer;
forming a protrusion and recess structural pattern on a portion of the top surface of the lower clad layer by etching a portion of the lower clad layer wherein the forming of the protrusion and recess structural pattern comprises: exposing the portion of the lower clad layer using a first etching process; and forming the protrusion and recess structural using a second etching process second occurrence; and
forming a first electrode on the upper clad layer and forming a second electrode on the protrusion and recess structural pattern of the lower clad layer.
2. The method of claim 1 , wherein the second etching process is one of a dry etching process and a wet etching process.
3. The method of claim 2 , wherein the wet etching process is performed using one of an aqueous H 3 PO 4 solution and an aqueous KOH solution.
4. The method of claim 2 , wherein the wet etching process is performed in a range of 100 to 300° C.
5. The method of claim 1 , wherein forming of the protrusion and recess structural pattern comprises forming of the protrusion and recess structural pattern all the way around a portion of the lower clad layer occupied by the active layer.