Method for manufacturing display device
View Patent ↗A method for manufacturing display devices including thin film transistors with high reliability in a high yield is provided. A gate insulating film is formed over a gate electrode; a microcrystalline semiconductor is formed over the gate insulating film; the microcrystalline semiconductor film is irradiated with a laser beam from the surface side thereof, whereby the crystallinity of the microcrystalline semiconductor film is improved. Then, a thin film transistor is formed using the microcrystalline semiconductor film whose crystallinity is improved. Further, a display device including the thin film transistor is manufactured.
1. A method for manufacturing a display device, comprising the steps of:
forming a gate electrode over a substrate;
forming a gate insulating film over the substrate and over the gate electrode;
forming a microcrystalline semiconductor film over the gate insulating film;
irradiating the microcrystalline semiconductor film with a laser beam;
forming a buffer layer comprising an amorphous semiconductor film over the microcrystalline semiconductor film, after the step of irradiating;
performing a nitrogen plasma treatment or a halogen plasma treatment to a surface of the buffer layer;
forming an impurity semiconductor film over the buffer layer, to which an impurity element which imparts one conductivity type is added;
forming a source region and a drain region by selectively etching the impurity semiconductor film;
forming a source electrode over the source region, and a drain electrode over the drain region; and
forming a pixel electrode in contact with one of the source electrode and the drain electrode.
2. The method for manufacturing the display device according to claim 1 , further comprising the steps of:
forming an interlayer insulating film over the source electrode and the drain electrode;
forming a contact hole over any one of the source electrode and the drain electrode; and
wherein the pixel electrode is formed over the interlayer insulating film, so as to be connected to the one of the source electrode and the drain electrode through the contact hole.
3. The method for manufacturing the display device according to claim 2 , further comprising the steps of:
forming a second contact hole over the other of the source electrode and the drain electrode; and
forming a wiring over the interlayer insulating film, which is connected to the other of the source electrode and the drain electrode through the second contact hole.
4. The method for manufacturing the display device according to claim 1 ,
wherein the microcrystalline semiconductor film comprises a semiconductor crystal with a crystal diameter of from 0.5 nm to 50 nm.
5. The method for manufacturing the display device according to claim 1 ,
wherein the amorphous semiconductor film includes any of nitrogen, hydrogen, fluorine, chlorine, bromine and iodine.
6. The method for manufacturing the display device according to claim 1 ,
wherein the display device is a liquid crystal display device.
7. The method for manufacturing the display device according to claim 1 ,
wherein the display device is a light-emitting device.
8. The method for manufacturing the display device according to claim 1 ,
wherein the buffer layer has a thickness of from 30 to 500 nm inclusive.
9. A method for manufacturing a display device, comprising the steps of:
forming a gate electrode over a substrate;
forming a gate insulating film over the substrate and over the gate electrode;
forming a microcrystalline semiconductor film over the gate insulating film;
irradiating the microcrystalline semiconductor film with a laser beam;
forming a buffer layer over the microcrystalline semiconductor film, after the step of irradiating;
forming an impurity semiconductor film over the buffer layer, to which an impurity element which imparts one conductivity type is added;
forming a source region and a drain region by selectively etching the impurity semiconductor film;
selectively etching the buffer layer and the microcrystalline semiconductor film after the step of forming the source region and the drain region;
forming a source electrode over the source region, and a drain electrode over the drain region, after the step of selectively etching the buffer layer and the microcrystalline semiconductor film; and
forming a pixel electrode in contact with one of the source electrode and the drain electrode.
10. The method for manufacturing the display device according to claim 9 , further comprising the steps of:
forming an interlayer insulating film over the source electrode and the drain electrode;
forming a contact hole over any one of the source electrode and the drain electrode; and
wherein the pixel electrode is formed over the interlayer insulating film, so as to be connected to the one of the source electrode and the drain electrode through the contact hole.
11. The method for manufacturing the display device according to claim 10 , further comprising the steps of:
forming a second contact hole over the other of the source electrode and the drain electrode; and
forming a wiring over the interlayer insulating film, which is connected to the other of the source electrode and the drain electrode through the second contact hole.
12. The method for manufacturing the display device according to claim 9 ,
wherein the microcrystalline semiconductor film comprises a semiconductor crystal with a crystal diameter of from 0.5 nm to 50 nm.
13. The method for manufacturing the display device according to claim 9 ,
wherein the buffer layer comprises an amorphous semiconductor film.
14. The method for manufacturing the display device according to claim 9 ,
wherein the buffer layer comprises an amorphous semiconductor film including any of nitrogen, hydrogen, fluorine, chlorine, bromine and iodine.
15. The method for manufacturing the display device according to claim 9 ,
wherein the display device is a liquid crystal display device.
16. The method for manufacturing the display device according to claim 9 ,
wherein the display device is a light-emitting device.
17. A method for manufacturing a display device, comprising the steps of:
forming a gate electrode over a substrate;
forming a gate insulating film over the substrate and over the gate electrode;
forming a microcrystalline semiconductor film over the gate insulating film;
irradiating the microcrystalline semiconductor film with a laser beam;
forming a buffer layer over the microcrystalline semiconductor film, after the step of irradiating;
forming an impurity semiconductor film over the buffer layer, to which an impurity element which imparts one conductivity type is added;
forming a conductive film over the impurity semiconductor film;
forming a first resist mask over the conductive film, by a photolithography process using a multi-tone photomask;
selectively etching the conductive film, the buffer layer and the microcrystalline semiconductor film;
forming a second resist mask by ashing the first resist mask;
forming a source electrode and a drain electrode by selectively etching the conductive film using the second resist mask;
forming a source region under the source electrode and a drain region under the drain electrode, by selectively etching the impurity semiconductor film using the second resist mask; and
forming a pixel electrode in contact with one of the source electrode and the drain electrode.
18. The method for manufacturing the display device according to claim 17 , further comprising the steps of:
forming an interlayer insulating film over the source electrode and the drain electrode;
forming a contact hole over any one of the source electrode and the drain electrode; and
wherein the pixel electrode is formed over the interlayer insulating film, so as to be connected to the one of the source electrode and the drain electrode through the contact hole.
19. The method for manufacturing the display device according to claim 18 , further comprising the steps of:
forming a second contact hole over the other of the source electrode and the drain electrode; and
forming a wiring over the interlayer insulating film, which is connected to the other of the source electrode and the drain electrode through the second contact hole.
20. The method for manufacturing the display device according to claim 17 ,
wherein the microcrystalline semiconductor film comprises a semiconductor crystal with a crystal diameter of from 0.5 nm to 50 nm.
21. The method for manufacturing the display device according to claim 17 ,
wherein the buffer layer comprises an amorphous semiconductor film.
22. The method for manufacturing the display device according to claim 17 ,
wherein the buffer layer comprises an amorphous semiconductor film including any of nitrogen, hydrogen, fluorine, chlorine, bromine and iodine.
23. The method for manufacturing the display device according to claim 17 ,
wherein the display device is a liquid crystal display device.
24. The method for manufacturing the display device according to claim 17 ,
wherein the display device is a light-emitting device.