Semiconductor apparatus
View Patent ↗A semiconductor apparatus capable of detecting a crack generated in a semiconductor chip while the design freedom, the layout freedom of a wiring, the layout efficiency of LSI, and the layout efficiency of a package substrate are improved. The semiconductor apparatus according to the invention includes a semiconductor chip having a multilayered wiring structure; plural electrode pads being formed on a top surface along the outer periphery of the semiconductor chip; and a wiring being coupled to a first electrode pad and a second electrode pad selected from the plural electrode pads and formed along the entire outer periphery of the semiconductor chip in plan view. The wiring includes a first wiring and a second wiring that are formed on different layers, and the first wiring and the second wiring are connected in series by a connection plug.
1. A semiconductor apparatus comprising:
a semiconductor chip having a multilayered wiring structure;
a plurality of electrode pads formed on a top surface of the semiconductor chip and along the outer periphery of said semiconductor chip; and
a wiring coupled to two electrode pads selected from said plurality of electrode pads, arranged to encircle by more than a full circle the outer periphery of said semiconductor chip, and a plurality of wirings between said two electrode pads in plan view,
wherein said plurality of wirings includes a first wiring formed on an upper layer and a second wiring formed on a lower layer,
wherein said first wiring and said second wiring are connected in series by a connection plug,
wherein said second wiring is disposed at every corner of said semiconductor chip, and
wherein said two electrode pads coupled to said wiring are formed along different edges of said semiconductor chip.
2. The semiconductor apparatus according to claim 1 ,
wherein said first wiring is formed on an uppermost layer.
3. The semiconductor apparatus according to claim 1 ,
wherein at least one of said plurality of electrode pads, which are coupled to said wiring, is coupled only to said wiring.
4. The semiconductor apparatus according to claim 3 ,
wherein said first wiring and said second wiring overlap at least partly in plan view.
5. The semiconductor apparatus according to claim 4 ,
wherein at least a part of said second wiring is formed directly below at least one of said plurality of electrode pads.
6. A semiconductor apparatus, according to claim 5 , wherein a plurality of semiconductor chips including the semiconductor chip are mounted on a substrate, and all of said wirings formed on said plurality of semiconductor chips respectively are connected in series by coupling said electrode pads.
7. The semiconductor apparatus according to claim 1 ,
wherein said first wiring and said second wiring overlap at least partly in plan view.
8. The semiconductor apparatus according to claim 7 ,
wherein at least a part of said second wiring is formed directly below at least one of said plurality of electrode pads.
9. A semiconductor apparatus, according to claim 8 , wherein a plurality of semiconductor chips including the semiconductor chip are mounted on a substrate, and all of said wirings formed on said plurality of semiconductor chips respectively are connected in series by coupling said electrode pads.
10. The semiconductor apparatus, as claimed in claim 1 , wherein the first wiring is overlapped with the second wiring at a space between the two electrode pads.
11. The semiconductor apparatus, as claimed in claim 1 , wherein the first wiring and the second wiring are provided with the different layers at a space between the two electrode pads.
12. A semiconductor apparatus, comprising:
a semiconductor chip;
a plurality of electrode pads formed on a top surface of the semiconductor chip and along an outer periphery of said semiconductor chip; and
a wiring coupled between two electrode pads selected from said plurality of electrode pads and arranged to encircle by more than a full circle the outer periphery of said semiconductor chip in plan view,
wherein the wiring includes a first wiring formed on an upper layer and a second wiring formed on a lower layer,
wherein the second wiring is disposed at every corner of the semiconductor chip, and
wherein the two electrode pads are formed along different edges of the semiconductor chip.
13. The semiconductor apparatus, as claimed in claim 12 , wherein the wiring is overlapped at a space between the two electrode pads.
14. The semiconductor apparatus, as claimed in claim 12 , wherein the wiring is provided with different layers at a space between the two electrode pads.
15. The semiconductor apparatus, as claimed in claim 12 , wherein the wiring encircles, by more than a full circle, the outer periphery of the semiconductor chip in order to detect a crack generated at any outer periphery of the semiconductor chip.