Methods for low cost manufacturing of complex layered materials and device
A process for manufacturing a device includes performing a plurality of non-bonding processes during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. The processes may be performed by a plurality of modules. The modules may be independently controlled and/or monitored. The modules may be interchangeable. One or more modules may receive and/or pass material to another module. The devices that are manufactured may be a layered device, a smart card, a sensor, an actuator, an in vitro diagnostic device, a microfluidic device, or a laminar product. An apparatus for manufacturing device includes at least one web-based manufacturing component and at least one sheet-based manufacturing component. The at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.
1. A process for manufacturing a microfluidic device, the process including a first processing that removes material followed by an embossing process, wherein the first processing improves the embossed structure replication; wherein the first process removes the device material to form cut-outs that mate with the embossing tool during the embossing process to reduce the amount of displaced material during the embossing process; or wherein the first process removes the device material to form undercut layers that control the flow displaced material into the undercut areas during the embossing process.