Substrate processing apparatus and semiconductor device manufacturing method

1. A substrate processing apparatus comprising:

a process chamber for processing a substrate;

a heater for heating an interior of the process chamber;

a holder for supporting the substrate in the process chamber; and

a substrate transfer plate for transferring the substrate to the holder;

wherein the holder has a retainer for supporting the substrate at its outer periphery and a main body for supporting the retainer, a portion of the retainer extending at least from a back region of the retainer with respect to an inserting direction of the substrate transfer plate to a region adjacent the back region and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being made thicker than other portions of the retainer.

2. The substrate processing apparatus of claim 1 , wherein the portion of the retainer lying outside the outer periphery of the substrate upon putting the substrate on the retainer is thicker than the other portions throughout the retainer in its entirety.

3. The substrate processing apparatus of claim 1 , wherein the back region of the retainer with respect to the inserting direction of the substrate transfer plate protrudes outside the other portions of the retainer.

4. The substrate processing apparatus of claim 1 , wherein the back region of the retainer with respect to the inserting direction of the substrate transfer plate is in a form to release a tip of the substrate transfer plate when the substrate is put on the retainer by the substrate transfer plate.

5. The substrate processing apparatus of claim 1 , wherein the back region of the retainer with respect to the inserting direction of the substrate transfer plate is arranged in a portion lying outside the outer periphery of the substrate upon putting the substrate on the retainer.

6. The substrate processing apparatus of claim 1 , wherein the back region of the retainer with respect to the inserting direction of the substrate transfer plate is a connecting portion through which different portions of the retainer are connected together, the connecting portion being arranged in a portion lying outside the outer periphery of the substrate upon putting the substrate on the retainer.

7. The substrate processing apparatus of claim 1 , wherein the retainer is provided with a cutout in a part thereof on an inserting side of the substrate.

8. The substrate processing apparatus of claim 1 , wherein the retainer is in a C-form.

9. The substrate processing apparatus of claim 1 , wherein the holder is structured to support a plurality of substrates horizontally with spacing in a stack form.

10. The substrate processing apparatus of claim 1 , wherein a thick walled portion of the retainer protrudes toward a surface thereof rather than the other portions of the retainer.

11. A substrate processing apparatus comprising:

a process chamber for processing a substrate;

a heater for heating an interior of the process chamber; and

a holder for supporting the substrate in the process chamber;

wherein the holder has a retainer for supporting the substrate at its outer periphery and a main body for supporting the retainer, the retainer having a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.

12. A holder comprising:

a retainer for supporting a substrate at an outer periphery thereof; and

a main body for supporting the retainer;

wherein the retainer has a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.

13. A holder comprising:

a retainer for supporting a substrate at an outer periphery thereof; and

a main body for supporting the retainer;

wherein the retainer has a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.

14. A retainer for supporting a substrate at an outer periphery thereof, the retainer supported by a main body, the retainer comprising:

a protrusion provided at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.

15. A retainer for supporting a substrate at an outer periphery thereof, the retainer comprising:

a protrusion provided at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.

16. A semiconductor device manufacturing method comprising:

supporting a substrate using a holder having a retainer for supporting the substrate at its outer periphery, and a main body for supporting the retainer, the retainer having a portion extending at least from a back region of the retainer with respect to an inserting direction of a substrate transfer plate to a region adjacent the back region and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer, the portion being made thicker than other portions of the retainer;

loading the substrate supported by the holder into a process chamber;

thermally processing the substrate supported by the holder in the process chamber; and

unloading the processed substrate from the process chamber.

17. A semiconductor device manufacturing method comprising:

supporting a substrate using a holder having a retainer for supporting the substrate at its outer periphery and a main body for supporting the retainer, the retainer having a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer;

loading the substrate supported by the holder into a process chamber;

thermally processing the substrate supported by the holder in the process chamber; and

unloading the processed substrate from the process chamber.