Electronic package device, module, and electronic apparatus
View Patent ↗There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrate 3 includes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film 7 ) is formed to increase strength of the wiring pattern.
1. An electronic device package, comprising:
a flexible interposer substrate including a wiring pattern therein;
at least one electronic device arranged on the interposer substrate; and
an insertion substrate similarly arranged on the interposer substrate, wherein
a reinforcing member is disposed to increase breaking strength of the wiring pattern in an area of the interposer substrate corresponding to a gap between the electronic device and the insertion substrate, and the reinforcing member is formed of a conductive material.
2. An electronic device package, comprising:
a flexible interposer substrate including a wiring pattern therein;
at least one electronic device arranged on the interposer substrate; and
an insertion substrate similarly arranged on the interposer substrate, wherein
a reinforcing member is disposed to increase breaking strength of the wiring pattern in an area of the interposer substrate corresponding to a gap between the electronic device and the insertion substrate,
wherein a metallic film is disposed on the wiring pattern as the reinforcing member.
3. The electronic device package in accordance with claim 2 , wherein the metallic film is disposed on both surfaces of the wiring pattern.
4. The electronic device package in accordance with claim 2 , wherein tensile strength of a material of the metallic film is higher than that of a material of the wiring pattern.
5. An electronic device package, comprising:
a flexible interposer substrate including a wiring pattern therein;
at least one electronic device arranged on the interposer substrate; and
an insertion substrate similarly arranged on the interposer substrate, wherein
a reinforcing member is disposed to increase breaking strength of the wiring pattern in an area of the interposer substrate corresponding to a gap between the electronic device and the insertion substrate,
wherein as the reinforcing member, there is disposed a metallic projection which is a projection of a portion of the wiring pattern.
6. The electronic device package in accordance with claim 5 , wherein between the metallic projection and the wiring pattern, there is formed a metallic film higher in tensile strength than the material of the wiring pattern.
7. The electronic device package in accordance with claim 1 , wherein the interposer substrate includes at least two layers of the wiring patterns, and a via filled with a conductor is disposed as the reinforcing member to establish connection between the wiring patterns.
8. The electronic device package in accordance with claim 1 , wherein an end section of the interposer substrate is bent to cover part of the insertion substrate and/or the electronic device.
9. The electronic device package in accordance with claim 1 , wherein part of a resin comprising the interposer substrate is a thermoplastic resin.
10. The electronic device package in accordance with claim 1 , wherein the insertion substrate includes a through-hole to accommodate the electronic device therein, and the gap is formed between an inner circumference of the through-hole and an outer circumference of the electronic device.
11. The electronic device package in accordance with claim 1 , wherein the insertion substrate includes a cavity to accommodate the electronic device therein, and the gap is formed between an inner circumference of the cavity and an outer circumference of the electronic device.
12. The electronic device package in accordance with claim 1 , wherein a passive element is formed between the insertion substrate and the interposer substrate.
13. The electronic device package, comprising electronic device packages in accordance with claim 1 , the packages being laminated in a plurality of layers.
14. The electronic device package, comprising a combination of at least one first electronic device package in accordance with claim 1 and at least one second electronic device package different in structure from the electronic device packages in accordance with claim 1 , the packages being laminated onto each other.
15. The module in which the electronic device package in accordance with claim 1 is installed on a circuit board.
16. The electronic apparatus in which the electronic device package in accordance with claim 1 is installed on a circuit board.
17. The electronic device package in accordance with claim 3 , wherein tensile strength of a material of the metallic film is higher than that of a material of the wiring pattern.
18. The electronic device package in accordance with claim 1 , wherein the reinforcing member is disposed over an area opposing the gap for at least either an upper surface or a rear surface of at least the wiring pattern located in a place closest to the gap.
19. The electronic device package in accordance with claim 18 , wherein the wiring pattern located in a place closest to the gap is disposed so as to extend over the width of the gap.