Method of fabricating an interconnection element having conductive posts

1. A method of fabricating an interconnection element having raised conductive posts for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, comprising:

a) forming conductive posts within a plurality of holes of a first element, each conductive post including at least a metal liner lining a wall of a corresponding hole, each post having an end within the corresponding hole;

b) forming terminals in conductive communication with the conductive posts; the terminals being connected through a dielectric layer to the conductive posts; and

c) removing at least a portion of the first element to cause the ends of the conductive posts to project outwardly beyond a first major surface of the interconnection element.

2. The method as claimed in claim 1 , wherein the first element is removed by etching the first element selectively relative to the metal liner.

3. The method as claimed in claim 2 , wherein the first element includes a first metal and the metal liner includes a second metal, the second metal resisting attack by an etchant used to selectively etch the first element.

4. The method as claimed in claim 3 , wherein step (a) includes forming a second metal layer in contact with the metal liner within the holes.

5. The method as claimed in claim 4 , further comprising forming the metal liner by processing including plating.

6. The method as claimed in claim 4 , wherein the step of forming the second metal layer includes plating.

7. The method as claimed in claim 6 , wherein the second metal layer fills the holes.

8. The method as claimed in claim 4 , wherein the second metal layer includes the first metal.

9. The method as claimed in claim 8 , wherein the first metal is copper and the metal liner includes nickel.

10. The method as claimed in claim 1 , wherein the first element includes a metal sheet consisting essentially of copper and the holes have a pitch less than about 150 microns.

11. The method as claimed in claim 10 , wherein the first element is formed by laser drilling through holes in a metal sheet and joining a carrier to a face of the metal sheet to cover the through holes.

12. The method as claimed in claim 10 , wherein the first element is formed by mechanically forming through holes in a metal sheet and joining a carrier to a face of the metal sheet to cover the through holes.

13. The method as claimed in claim 10 , wherein the conductive posts have frusto-conical shape.

14. The method as claimed in claim 10 , wherein conductive posts have cylindrical shape.

15. The method as claimed in claim 1 , wherein the posts do not completely fill the holes of the first element.

16. The method as claimed in claim 1 , wherein step (a) further includes forming metal features extending away from the posts along at least one surface of the first element, the metal features defining at least one electrically conductive trace extending from at least one post.

17. The method as claimed in claim 16 , further comprising forming a dielectric layer atop the posts and the at least one trace, and forming at least one second metal layer extending through the dielectric layer and electrically connected with the metal layer.

18. The method as claimed in claim 17 , wherein the second metal layer is electrically connected with the at least one conductive trace.

19. The method as claimed in claim 17 , wherein step (b) includes forming a second dielectric layer overlying the second metal layer and forming a third metal layer extending through the second dielectric layer and electrically connected with the second metal layer.

20. The method as claimed in claim 1 , wherein step (b) is performed such that the terminals are exposed at a second major surface opposite the first major surface from which the conductive posts project outwardly.

21. A method of fabricating an interconnection element, comprising:

a) forming conductive posts within a plurality of respective blind holes of a first element, the first element including a first metal, each conductive post having a liner including a second metal lining the respective hole, a layer including a third metal contacting the liner within the hole, and an end located within the respective hole, the second metal being resistant to attack by an etchant which attacks the first metal;

b) forming terminals exposed at a bottom surface of the interconnection element, the terminals being in conductive communication with the conductive posts; and

c) selectively removing at least some of the first metal from the first element using the etchant to cause at least the ends of the conductive posts to protrude beyond a top surface of the interconnection element, the top surface being opposite the bottom surface.

22. The method as claimed in claim 21 , wherein the posts do not completely fill the holes of the first element.

23. The method as claimed in claim 21 , wherein step (a) further includes forming metal features extending away from the posts along at least one surface of the first element, the metal features defining at least one electrically conductive trace extending from at least one post.

24. The method as claimed in claim 23 , further comprising forming a dielectric layer atop the posts and the at least one trace, and forming at least one second metal layer extending through the dielectric layer and electrically connected with the metal layer.

25. The method as claimed in claim 24 , wherein the second metal layer is electrically connected with the at least one conductive trace.

26. The method as claimed in claim 24 , wherein step (b) includes forming a second dielectric layer overlying the second metal layer and forming a third metal layer extending through the second dielectric layer and electrically connected with the second metal layer.