Semiconductor device fabricated by selective epitaxial growth method
View Patent ↗A semiconductor device in which selectivity in epitaxial growth is improved. There is provided a semiconductor device comprising a gate electrode formed over an Si substrate, which is a semiconductor substrate, with a gate insulating film therebetween and an insulating layer formed over sides of the gate electrode and containing a halogen element. With this semiconductor device, a silicon nitride film which contains the halogen element is formed over the sides of the gate electrode when an SiGe layer is formed over the Si substrate. Therefore, the SiGe layer epitaxial-grows over the Si substrate with high selectivity. As a result, an OFF-state leakage current which flows between, for example, the gate electrode and source/drain regions is suppressed and a manufacturing process suitable for actual mass production is established.
1. A semiconductor device comprising:
a gate electrode formed over a semiconductor substrate;
an insulating film formed over side wall portions of the gate electrode and containing chlorine in an upper most surface of the insulating film,
wherein the upper most surface of the insulating film has a higher concentration of chlorine than portions of the insulating film in contact with the side wall portions of the gate electrode.
2. The semiconductor device according to claim 1 , wherein the semiconductor substrate has a semiconductor epitaxial growth layer.
3. The semiconductor device according to claim 1 , wherein the insulating film has a laminated structure.
4. The semiconductor device according to claim 3 , wherein the laminated structure has at least three layers.
5. The semiconductor device according to claim 1 , wherein the insulating film contains silicon and nitrogen.
6. The semiconductor device according to claim 1 , wherein the semiconductor substrate is selected from one of silicon, silicon which contains germanium, and germanium.
7. The semiconductor device according to claim 3 , wherein the upper most surface of the insulating film has 5×10 19 to 5×10 21 atoms/cm 3 of the concentration of chlorine when the insulating film thickness has 10 to 60 nm.
8. The semiconductor device according to claim 1 , wherein the proportion of silicon to nitrogen (Si/N) of the insulating film is at least 0.77.
9. The semiconductor device according to claim 8 , wherein the halogen element is one of chlorine and bromine.