Semiconductor device, and manufacturing method of semiconductor device
View Patent ↗In a technique connecting between bonding pads of semiconductor chips, contact between wires is prevented. A semiconductor device of the present embodiment is provided with a semiconductor chip 1 in which a plurality of bonding pads 3 are arranged in line, a semiconductor chip 2 in which a plurality of bonding pads 4 are arranged in line substantially parallel to the plurality of bonding pads 3 , and a plurality of wires 7 which connect the bonding pads 3 to the bonding pads 4 respectively. At least one of the wires 7 is bended with respect to a reference straight line S which passes through the bonding pad 3 and the bonding pad 4 which are connected by the wire 7 . The bended wire is extended out from the bonding pad 4 in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.
1. A semiconductor device, comprising:
a first semiconductor chip in which a plurality of first bonding pads are arranged in line;
a second semiconductor chip in which a plurality of second bonding pads are arranged in line substantially parallel to the plurality of first bonding pads; and
a plurality of wires each connecting the first bonding pad to the second bonding pad, respectively,
wherein at least one of the wires is bended with respect to a reference straight line passing through the first bonding pad and the second bonding pad which are connected by the wire, and
the bended wire is extended out from the second bonding pad in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.
2. The semiconductor device according to claim 1 ,
wherein a formula of 0<θ 2 <θ 1 is satisfied, where θ 1 is an angle formed between a line orthogonal to the aligned direction of the second bonding pads and the reference straight line of the bended wire, and θ 2 is an angle formed between an extending direction of the bended wire and the reference straight line of the bended wire.
3. The semiconductor device according to claim 1 ,
wherein the bended wire is extended out in a substantially orthogonal direction in the aligned direction of the second bonding pads.
4. The semiconductor device according to claim 1 ,
wherein a rising part of the wire is formed in a first bonding part connecting the first bonding pad with the wire, and an inclined part of the wire is formed in a second bonding part connecting the second bonding pad with the wire.
5. The semiconductor device according to claim 4 ,
wherein the first bonding part connects the first bonding pad with the wire through a ball, and the rising part is formed in an upper side of the ball.
6. The semiconductor device according to claim 1 ,
wherein a pad distance between the first bonding pads is the same as that between the second bonding pads.
7. A semiconductor device, comprising:
a first semiconductor chip in which a plurality of first bonding pads are arranged in line;
a second semiconductor chip in which a plurality of second bonding pads are arranged in line substantially parallel to the plurality of first bonding pads,
a first wire connecting one of the first bonding pads to one of the second bonding pads; and
a second wire, which is adjacent to the first wire, connecting another first bonding pads to another second bonding pads,
wherein the first distance between the first wire and the second wire in the vicinity of the second bonding pads is larger than the second distance between the first wire and the second wire in the vicinity of the first bonding pads.
8. The semiconductor device according to claim 7 ,
wherein the first distance is the distance between the first wire and the second wire in the portion from the second bonding pads to the bending point of at least one bended wire.
9. A method for manufacturing a semiconductor device including a first semiconductor chip in which a plurality of first bonding pads are arranged in line, a second semiconductor chip in which a plurality of second bonding pads are arranged in line substantially parallel to the plurality of first bonding pads, and a plurality of wires each connecting the first bonding pad to the second bonding pad, respectively, wherein, at least one of the wires is bended with respect to a reference straight line passing through the first bonding pad and the second bonding pad which are connected by the wire, and the bended wire is extended out from the second bonding pad in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire; said method for manufacturing comprising:
forming a bump on the second bonding pad;
connecting a ball formed at a tip of the wire inserted into a capillary to the first bonding pad, and forming a rising part of the wire in an upper side of the ball to form a first bonding part;
bending the wire to form a bended wire by moving the capillary; and
forming a second bonding part by connecting the wire with the second bonding pad through the bump.