IP Library › Granted Patent US 7,659,605
Granted Patent B2
US 7,659,605 · App. 12/232,883 · Granted Feb 9, 2010

COF board

Assignee: Nitto Denko Corporation
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Quick Facts
Patent No.
US 7,659,605
App. No.
12/232,883
Granted
Feb 9, 2010
Kind
B2
Abstract

A COF board includes an insulating layer, and a terminal portion formed on the insulating layer. The terminal portion includes a first lead extending in a longitudinal direction, and a second lead extending in the longitudinal direction, and having a smaller length in the longitudinal direction than a length of the first lead in the longitudinal direction. The first leads are arranged in spaced-apart relation in a direction perpendicular to the longitudinal direction. The second leads are arranged in the direction perpendicular to the longitudinal direction to be interposed between the mutually adjacent first leads such that, when the mutually adjacent first leads are projected in an adjacent direction thereof, overlap portions where the second leads overlap with the first leads and non-overlap portions where the second leads do not overlap with the first leads are formed. Dummy leads are provided at the non-overlap portions.

Claims (10)

1. A COF board comprising:

an insulating layer; and

a terminal portion formed on the insulating layer, and electrically connected to an electronic component, wherein

the terminal portion comprises a first lead extending in a longitudinal direction, and a second lead extending in the longitudinal direction, and having a length in the longitudinal direction smaller than a length of the first lead in the longitudinal direction,

a plurality of the first leads are arranged in spaced-apart relation in a direction perpendicular to the longitudinal direction,

a plurality of the second leads are arranged in the direction perpendicular to the longitudinal direction to be interposed between the mutually adjacent first leads such that, when the mutually adjacent first leads are projected in an adjacent direction thereof, overlap portions where the second leads overlap with the first leads and non-overlap portions where the second leads do not overlap with the first leads are formed, and

dummy leads are provided at the non-overlap portions.

2. The COF board according to claim 1 , wherein the terminal portion is formed by electrolytic plating.

3. The COF board according to claim 1 , wherein a length of each of the dummy leads in the direction perpendicular to the longitudinal direction is smaller than or the same as a length of the second lead in the direction perpendicular to the longitudinal direction.

4. The COF board according to claim 1 , wherein a length of each of the dummy leads in the longitudinal direction is larger than a spacing between the dummy lead and the second lead in the longitudinal direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2008
From: ISHIMARU, YASUTO; EBE, HIROFUMI
To: NITTO DENKO CORPORATION
Reel/Frame 021966/0082 →
Priority Claims (1)
JP 2007-264797 · Oct 10, 2007 · national
Continuity (1)
Related Publication 20090096069A1 · Apr 16, 2009