IP Library Granted Patent US 8,672,231
Granted Patent B2
US 8,672,231 · App. 12/235,043 · Granted Mar 18, 2014

Integrated circuit system with antenna

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Quick Facts
Patent No.
US 8,672,231
App. No.
12/235,043
Granted
Mar 18, 2014
Kind
B2
Abstract

A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.

Claims (38)

1. An integrated circuit system comprising:

a substrate;

an integrated circuit device connected to the substrate and having a side exposed;

a first pad on the substrate connected to the integrated circuit device;

a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;

a plurality of first pillars over the first pad;

a second dielectric layer over the plurality of first pillars, the second dielectric layer having an opening provided therein exposing the plurality of first pillars;

an upper redistribution layer over the second dielectric layer;

an antenna made from the upper redistribution layer, the antenna connected to the plurality of first pillars; and

a third dielectric layer over the second dielectric layer and over the antenna.

2. The system as claimed in claim 1 further comprising a lower redistribution layer in contact with the first pad and connected to the plurality of first pillars.

3. The system as claimed in claim 1 further comprising a plurality of second pillars on the plurality of first pillars and over the second dielectric layer, the plurality of second pillars connected to the antenna.

4. The system as claimed in claim 1 further comprising:

a plurality of second pillars on the plurality of first pillars;

a third dielectric layer over the plurality of second pillars, the third dielectric layer having an opening provided therein exposing the plurality of second pillars; and

a plurality of third pillars on the plurality of second pillars in the opening in the third dielectric layer, the plurality of third pillars in contact with the antenna.

5. The system as claimed in claim 1 further comprising:

a plurality of pillars on the first pad, the plurality of pillars connected to one end of the antenna;

a second pillar connected to the other end of the antenna; and

a second pad connected to the second pillar.

6. An integrated circuit system comprising:

a substrate;

an integrated circuit device connected to the substrate and having a side exposed;

a first pad on the substrate connected to the integrated circuit device;

a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;

an upper redistribution layer and a lower redistribution layer in contact with each other and connected to the first pad;

an antenna made from the upper redistribution layer, the antenna connected to the first pad; and

a second dielectric layer over the first dielectric layer and over the antenna.

7. The system as claimed in claim 6 further comprising a lower redistribution layer contacting the first pad and connected to the antenna.

8. The system as claimed in claim 6 further comprising a pillar on the first pad and over the first dielectric layer, the pillar connected to the antenna.

9. The system as claimed in claim 6 further comprising:

a first pillar on the first pad;

a third dielectric layer over the first pillar, the third dielectric layer having an opening provided therein exposing the first pillar; and

a second pillar on the first pillar in the opening in the third dielectric layer, the second pillar in contact with the antenna.

10. The system as claimed in claim 6 further comprising:

a plurality of pillars on the first pad, the plurality of pillars connected to one end of the antenna;

a second pillar connected to the other end of the antenna; and

a second pad connected to the second pillar.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →
SECURITY AGREEMENT Recorded Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →