Carbon nanotube MEMS assembly
A carbon nanotube MEMS assembly comprises a plurality of carbon nanotubes oriented into a patterned frame, the patterned frame defining at least two components of a MEMS device. An interstitial material at least partially binds adjacent carbon nanotubes one to another. At least one component of the frame is fixed and at least one component of the frame is movable relative to the fixed component.
1. A carbon nanotube MEMS assembly, comprising:
a plurality of carbon nanotubes oriented in a generally linear orientation into a patterned frame, the plurality of nanotubes extending vertically from a base of the frame to a face of the frame, the patterned frame defining at least two components of a MEMS device, the frame comprising one or more passages;
an interstitial material, at least partially binding adjacent carbon nanotubes one to another;
at least one component of the frame being fixed and at least one component of the frame being movable relative to the fixed component;
wherein the nanotubes oriented into the frame define in the frame one or more interstitial material access holes, wherein each of the interstitial material access holes extends from the face of the frame to the base of the frame and is substantially devoid of nanotubes;
wherein the one or more passages are substantially devoid of nanotubes coated with the interstitial material, and
wherein the size of the one or more passages is greater than the size of the one or more interstitial material access holes.
2. The MEMS assembly of claim 1 , wherein the at least one fixed component is attached to a substrate.
3. The MEMS assembly of claim 1 , wherein the size of the interstitial material access holes is greater than the size of interstices between adjacent nanotubes.
4. The MEMS assembly of claim 3 , wherein adjacent nanotubes are interlocked one with another.
5. The MEMS assembly of claim 3 , wherein the size of the one or more passages is 10 microns or greater and the size of the one or more interstitial material access holes is from about 3 to about 20 microns.
6. The MEMS assembly of claim 5 , wherein the interstitial material access holes have a size larger than an interstice between adjacent nanotubes.
7. The MEMS assembly of claim 1 , wherein the assembly comprises a thermomechanical in-plane microactuator.
8. The MEMS assembly of claim 1 , wherein the assembly comprises a comb drive.
9. The MEMS assembly of claim 1 , wherein the assembly comprises a bistable mechanism.
10. The MEMS assembly of claim 1 , wherein the interstitial material comprises a material applied by a vapor deposition process.
11. The MEMS assembly of claim 10 , wherein the interstitial material floor layer in areas adjacent to movable components is removed to enable the release etch.
12. The MEMS assembly of claim 11 , wherein the floor layer adjacent to the movable parts is removed via Reactive Ion Etching.
13. The MEMS assembly of claim 1 , wherein each of the plurality of carbon nanotubes extends substantially linearly from the base of the frame to the face of the frame.