Substrate package with through holes for high speed I/O flex cable
View Patent ↗An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
1. A semiconductor device, comprising:
a plurality of die bump pads formed on a substrate package;
a die attached to the plurality of die bump pads;
a plurality of input/output (I/O) contact pads formed on the package, wherein the I/O contact pads are electrically connected with the die bump pads;
a plurality of hermetically-sealed substrate guiding through holes formed adjacent to the I/O contact pads;
a plurality of cable contacts formed proximate to both ends of a flex cable, wherein the cable contacts proximate to one end of the flex cable are electrically connected with the I/O contact pads; and
a guiding plate detachably disposed on the flex cable, wherein the guiding plate includes a plurality of guiding pins penetrating the substrate guiding through holes.
2. The device of claim 1 , further comprising a heat sink disposed on the die and the guiding plate.
3. The device of claim 2 , further comprising a flex connector disposed between the package and the one or more flex cables, wherein the flex connector includes a plurality of connector contacts and a plurality of connector guiding through holes.
4. The device of claim 3 , wherein the plurality of connector contacts is electrically connected with the plurality of I/O contact pads and the plurality of cable contacts.
5. The device of claim 4 wherein the flex cable includes at least one cable guiding through hole formed proximate to each end of the flex cable.
6. The device of claim 5 , wherein the plurality of guiding pins penetrates the plurality of connector guiding through holes and the plurality of cable guiding through holes.
7. The device of claim 1 , wherein the plurality of substrate guiding through holes is electrically isolated.
8. The device of claim 7 , wherein the plurality of substrate guiding through holes is plated by copper.
9. The device of claim 8 , wherein the thickness of copper is 15-25 μm.
10. An electronic assembly, comprising:
a first substrate package and a second substrate package, wherein each package includes a die attached to a plurality of die bump pads;
a plurality of input/output (I/O) contact pads formed on the substrate packages, wherein the I/O contact pads are electrically connected with the die bump pads;
a plurality of hermetically-sealed substrate guiding through holes formed adjacent to the I/O contact pads;
a plurality of cable contacts formed proximate to both ends of a flex cable, wherein the cable contacts are electrically connected with the I/O contact pads; and
a guiding plate disposed proximate to each end of the flex cable, wherein the guiding plate includes a plurality of guiding pins penetrating the substrate guiding through holes.
11. The assembly of claim 10 , wherein the flex cable includes at least one cable guiding through hole formed proximate to each end of the flex cable.
12. The assembly of claim 11 , further comprising a flex connector disposed between each of the package and the flex cable, wherein the flex connector includes a plurality of connector contacts and a plurality of connector guiding through holes.
13. The assembly of claim 12 , wherein the connector contacts are electrically connected with the I/O contact pads and cable contacts.
14. The assembly of claim 13 , wherein the guiding pins penetrate the connector guiding through holes and cable guiding through holes.
15. The assembly of claim 14 , wherein the substrate guiding through holes are electrically isolated and plated with copper of thickness between 15-25 μm.