IP Library Granted Patent US 8,188,560
Granted Patent B2
US 8,188,560 · App. 12/242,570 · Granted May 29, 2012

Optical color sensor system

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,188,560
App. No.
12/242,570
Granted
May 29, 2012
Kind
B2
Abstract

An optical color sensor system is provided including providing a substrate having an optical sensor therein and forming a passivation layer over the substrate. The passivation layer is planarized and color filters are formed over the passivation layer. A planar transparent layer is formed over the color filters and microlenses are formed on the planar transparent layer over the color filters.

Claims (118)

1. A method of manufacture of an optical color sensor system comprising:

providing a substrate having an optical sensor therein;

forming a passivation layer over the substrate;

planarizing the passivation layer;

forming color filters over the passivation layer;

forming a planar transparent layer over the color filters, the planar transparent layer exposing a sidewall of at least one of the color filters; and

forming microlenses on the planar transparent layer over the color filters.

2. The method as claimed in claim 1 further comprising:

forming the passivation layer further comprises:

depositing an encapsulating passivation layer, and

forming a top passivation layer on the encapsulating passivation layer; and

planarizing the passivation layer further comprises:

planarizing the top passivation layer to remove the top passivation layer and a portion of the encapsulating passivation layer.

3. The method as claimed in claim 1 further comprising:

providing a metal pad on the substrate connected to the optical sensor;

forming the passivation layer further comprises:

encapsulating the metal pad in an encapsulating passivation layer, and

forming a top passivation layer on the encapsulating passivation layer; and

planarizing the passivation layer further comprises:

planarizing the top passivation layer to remove the top passivation layer and a portion of the encapsulating passivation layer.

4. The method as claimed in claim 1 further comprising:

providing a metal pad on the substrate connected to the optical sensor;

forming the passivation layer further comprises:

depositing a hard mask layer on the passivation layer,

forming a passivation mask on the hard mask layer,

processing the hard mask layer using the passivation mask, and

processing the passivation layer using the hard mask layer;

coating the metal pad and the hard mask layer with a coating layer;

removing the coating layer from the metal pad; and

forming the color filters forms the color filters on the coating layer.

5. The method as claimed in claim 1 further comprising:

depositing a coating layer over the passivation layer;

forming the color filters further includes:

depositing a red color filter, a blue color filter, and a green color filter on the coating layer;

depositing a planar transparent layer on the color filters; and

forming the microlenses further comprises:

forming the microlenses on the coating layer over the red color filter, the blue color filter, and the green color filter.

6. A method of manufacture of an optical color sensor system comprising:

providing a substrate having an optical sensor therein;

depositing a passivation layer over the substrate;

planarizing the passivation layer;

depositing color filters over the passivation layer after planarization;

depositing a planar transparent layer on and over the color filters, the planar transparent layer exposing a sidewall of at least one of the color filters; and

forming microlenses on the planar transparent layer over each of the color filters.

7. The method as claimed in claim 6 further comprising:

depositing the passivation layer further comprises:

depositing an encapsulating passivation layer on the substrate, and

forming a top passivation layer on the encapsulating passivation layer; and

planarizing the passivation layer further comprises:

polishing the top passivation layer to remove the top passivation layer and a portion of the encapsulating passivation layer.

8. The method as claimed in claim 6 further comprising:

providing a metal pad on the substrate connected to the optical sensor;

depositing the passivation layer further comprises:

encapsulating the metal pad in an encapsulating passivation layer, the encapsulating passivation layer includes a material selected from silicon dioxide, silicon nitride, an alloy thereof, a compound thereof, and a combination thereof, and

depositing a top passivation layer on the encapsulating passivation layer; and

planarizing the passivation layer further comprises:

polishing the top passivation layer to remove the top passivation layer and a portion of the encapsulating passivation layer, the polishing back of the encapsulating passivation layer to a thickness of about 6,000 Å over the metal pad.

9. The method as claimed in claim 6 further comprising:

providing a metal pad on the substrate connected to the optical sensor;

depositing the passivation layer further comprises:

depositing a hard mask layer on the passivation layer,

forming a passivation mask on the hard mask layer,

processing the hard mask layer using the passivation mask, and

processing the passivation layer using the hard mask layer;

coating the metal pad and the hard mask layer with a bottom anti-reflective coating;

removing the coating layer from the metal pad; and

depositing the color filters form the color filters on the coating layer.

10. The method as claimed in claim 6 further comprising:

depositing a coating layer over the passivation layer; and

depositing the color filters further includes:

depositing a red color filter, a blue color filter, and a green color filter on the coating layer;

depositing a planar transparent layer on the color filters; and

forming the microlenses further comprises:

forming the microlenses on the planar transparent layer over the red color filter, the blue color filter, and the green color filter.

11. An optical color sensor system comprising:

a substrate;

an optical sensor in the substrate;

a planarized passivation layer over the substrate;

color filters over the passivation layer;

a planar transparent layer over the color filters, the planar transparent layer exposing a sidewall of at least one of the color filters; and

microlenses on the planar transparent layer over the color filters.

12. The system as claimed in claim 11 further comprising:

the passivation layer further comprises:

an encapsulating passivation layer.

13. The system as claimed in claim 11 further comprising:

a metal pad on the substrate connected to the optical sensor;

the passivation layer further comprises:

an encapsulating passivation layer encapsulating the metal pad with the top surface of the metal pad exposed.

14. The system as claimed in claim 11 further comprising:

a coating layer over the passivation layer;

the color filters further include:

a red color filter, a blue color filter, and a green color filter on the coating layer;

a planar transparent layer on the color filters; and

the microlenses further comprise:

the microlenses on the coating layer over the red color filter, the blue color filter, and the green color filter.

15. The system as claimed in claim 11 comprising:

the substrate having an optical sensor therein for detecting light thereon;

the passivation layer over the substrate providing a planarized surface;

the color filters over the planarized surface of the passivation layer;

the planar transparent layer on and over the color filters; and

the microlenses on and over the planar transparent layer over each of the color filters.

16. The system as claimed in claim 15 further comprising:

the passivation layer further comprises an encapsulating passivation layer on the substrate, the encapsulating passivation layer characterized in having a planar top surface.

17. The system as claimed in claim 15 further comprising:

a metal pad on the substrate connected to the optical sensor; and

the passivation layer further comprises an encapsulating passivation layer encapsulating the metal pad of a thickness of about 6,000 Å over the metal pad.

18. The system as claimed in claim 15 further comprising:

a metal pad on the substrate connected to the optical sensor;

the passivation layer further comprises:

a hard mask layer on the passivation layer, and

a passivation mask on the hard mask layer;

a coating layer of a bottom anti-reflective coating on the hard mask layer; and

the color filters formed on the coating layer.

19. The system as claimed in claim 15 further comprising:

a coating layer over the passivation layer;

the color filters further includes a red color filter, a blue color filter, and a green color filter on the coating layer;

a planar transparent layer on the color filters; and

the microlens further comprises the microlenses formed on the coating layer over the red color filter, the blue color filter, and the green color filter.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →
SECURITY AGREEMENT Recorded Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →