Polishing pad with controlled void formation
A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.
1. A method of forming a chemical-mechanical planarization polishing pad comprising:
providing a composition, the composition including a network of elements in the form of a fabric and at least one of a polymer or a reactive prepolymer wherein said polymer or prepolymer is dispensed over said elements in a mold;
introducing a first gas to the composition;
using the gas to produce a plurality of voids in the composition wherein said voids define a space of 0.1 μm 3 to 1,000,000 μm 3 ; and
forming a polishing pad including said network of elements in the form of said fabric dispersed within said polymer or said reactive prepolymer including said plurality of voids formed in the pad, wherein at least a portion of said network of elements is connected to at least a portion of said voids and wherein said network of elements comprises a plurality of soluble fibers wherein said fibers have a length in the range of 0.1 mm to 500 mm and a diameter in the range of 0.1 μm to 100 μm and are present at a level of 2% to 75% by volume of the polishing.
2. The method of claim 1 wherein the step of introducing a first gas to the composition is accomplished by a component of the composition which volatilizes to provide the gas.
3. The method of claim 2 wherein the component volatilizes as a result of at least one of a chemical reaction, thermal reaction and exposure to heat.
4. The method of claim 2 wherein the component comprises a blowing agent.
5. The method of claim 2 wherein the component is provided with the network of elements.
6. The method of claim 1 wherein the step of introducing a first gas to the composition is accomplished by exposing a blowing agent within the composition to a condition which generates the gas.
7. The method of claim 6 wherein the blowing agent is provided with the network of elements.
8. The method of claim 1 wherein the composition is provided by placing the network of elements into a mold and thereafter introducing at least one of the polymer and the reactive prepolymer into the mold.
9. The method of claim 1 wherein the first gas is introduced to the composition during a gelation of the composition in a mold.
10. The method of claim 1 wherein the network of elements is interconnecting.
11. The method of claim 1 wherein the network of elements is provided in a layer within the pad.
12. The method of claim 1 wherein at least a portion of the network of elements is hydrophilic.
13. The method of claim 1 wherein the fibers are provided in a form of a sheet.
14. The method of claim 1 , wherein said network of elements has a dimension of length, width and/or thickness, and one of said length, width or thickness dimension is changed by the application of a force in the presence of one of said polymer or reactive prepolymer, wherein said force is removed and at least one of said length, width and/or thickness changes in value to form one or a plurality of voids.
15. The method of claim 1 wherein said first gas comprise air.
16. A method of forming a chemical-mechanical planarization polishing pad comprising:
providing a composition, the composition including a network of elements and at least one of a polymer and a reactive prepolymer, wherein said network of elements comprises a plurality of fibers in the form of a fabric, wherein said network of element has a dimension of length, width and/or thickness and said fabric exhibits an elastic recovery of 1.0 to 99%;
changing one of said length, width or thickness dimension by the application of a force in the presence of one of said polymer or reactive prepolymer;
removing said force, wherein said fabric recovers and said at least one of said length, width and/or thickness changes in value to form one or a plurality of voids; and
forming a polishing pad including said network of elements in the form of said fabric dispersed within said polymer or said reactive prepolymer including said plurality of voids formed in the pad, wherein at least a portion of a said network of elements is connected to at least a portion of said voids.