Method of manufacturing nitride semiconductor light emitting device and nitride semiconductor light emitting device manufactured using the method
View Patent ↗There are provided a method of manufacturing a nitride semiconductor light emitting device and a nitride semiconductor light emitting device manufactured using the same. A method of manufacturing a nitride semiconductor light emitting device according to an aspect of the invention includes: forming a mask layer on a substrate; removing a portion of the mask layer to form openings provided as regions where light emitting structures are formed; forming a light emitting structure by sequentially growing a first conductivity type nitride semiconductor layer, an active layer, and a second conductivity type nitride semiconductor layer on the substrate through each of the openings of the mask layer; and forming first and second electrodes to be electrically connected to the first and second conductivity type nitride semiconductor layers, respectively.
1. A method of manufacturing a nitride semiconductor light emitting device, the method comprising:
forming a mask layer on a substrate;
removing a portion of the mask layer to form openings provided as regions where light emitting structures are formed;
forming a light emitting structure by sequentially growing a first conductivity type nitride semiconductor layer, an active layer, and a second conductivity type nitride semiconductor layer on the substrate through each of the openings of the mask layer; and
forming first and second electrodes to be electrically connected to the first and second conductivity type nitride semiconductor layers, respectively,
wherein each of the openings of the mask layer has a roughened side surface, and each of the light emitting structures is grown and has a side surface having the same shape as the roughened surface.
2. The method of claim 1 , wherein the mask layer comprises a plurality of openings, and one light emitting structure is formed within each of the plurality of openings.
3. The method of claim 2 , wherein neighboring openings of the plurality of openings are separated from each other by a distance of 5 um or more.
4. The method of claim 2 , further comprising:
cutting the substrate and the mask layer on the basis of the light emitting structures after forming the light emitting structure.
5. The method of claim 1 , wherein the mask layer has a thickness of 20 nm or more.
6. The method of claim 1 , wherein the forming a light emitting structure is performed so that the light emitting structure has a narrower width toward a direction in which the light emitting structure grows.
7. The method of claim 6 , wherein the forming a light emitting structure is performed so that the side surface of the light emitting structure has a slope of 40 to 85 degrees with respect to a horizontal plane.
8. The method of claim 1 , wherein the mask layer is formed of a silicon oxide or a silicon nitride.
9. The method of claim 1 , wherein the mask layer is formed of a transparent conductive oxide or a metal.
10. The method of claim 1 , wherein the first and second conductivity type nitride semiconductor layers are n-type and p-type nitride semiconductor layers, respectively.
11. A nitride semiconductor light emitting device manufactured using the method of claim 1 .