IP Library Granted Patent US 8,154,880
Granted Patent B1
US 8,154,880 · App. 12/253,891 · Granted Apr 10, 2012

Method and apparatus for active line interface isolation

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Quick Facts
Patent No.
US 8,154,880
App. No.
12/253,891
Granted
Apr 10, 2012
Kind
B1
Abstract

A method and apparatus for active line interface isolation have been described.

Claims (15)

1. An apparatus comprising:

a first unit having a back side and a connection side, said back side fixedly attached to a substrate, said substrate having connection points;

a spacer having a first side and a second side, said first side fixedly attached to said first unit connection side;

a second unit having a back side and a connection side, said back side fixedly attached to said spacer second side;

a first wire having a proximate end and a distal end, wherein said first wire proximate end is attached to one of said substrate connection points and said first wire distal end is attached to said first unit connection side;

a second wire having a proximate end and a distal end, wherein said second wire proximate end is attached to said first unit connection side and said second wire distal end is attached to said second unit connection side; and

a third wire having a proximate end and a distal end, wherein said third wire proximate end is attached to said second unit connection side and said third wire distal end is attached to said one of said substrate connection points.

2. The apparatus of claim 1 wherein said first wire, said second wire, and said third wire are a single electrical node.

3. A method comprising:

mounting a first unit having a plurality of connection pads on a substrate having a plurality of connection pads;

mounting on said first unit a spacer; and

mounting on said spacer a second unit having a plurality of connection pads and wherein said first unit and said second unit are redundant units;

creating a first connection from a one of said plurality of connection pads on said substrate to a one of said plurality of connection pads on said first unit;

creating a second connection from said one of said plurality of connection pads on said first unit to a one of said plurality of connection pads on said second unit; and

creating a third connection from said one of said plurality of connection pads on said second unit to said one of said plurality of connection pads on said substrate.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2008
From: BICKNELL, JEREMY
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 021699/0551 →