Multi-layer distributed network
View Patent ↗Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the network to logic elements on the integrated circuit. The network may be evenly distributed across the base layer of the integrated circuit. Even distribution of the network may reduce skew of the test signals. Buffers are also placed along the structured network. The buffers may be placed to ensure a deterministic test signals distribution. Unused buffers in the base layer may be tied off to reduce current leakage.
1. An integrated circuit, comprising:
a plurality of layers, each of the plurality of layers is a fixed layer with a network for device-wide distribution of test signals, wherein the network spans across quadrants within one of the plurality of layers from a center region of the one of the plurality of layers, and wherein the network branches into sub-networks from a center region of each of the quadrants; and
a customizable layer, wherein the customizable layer connects the network to logic elements on the integrated circuit for testing said logic elements.
2. The integrated circuit of claim 1 , wherein the network is a test network with a predetermined structure.
3. The integrated circuit of claim 1 , wherein the integrated circuit comprises a programmable logic device (PLD).
4. The integrated circuit of claim 1 , wherein the network comprises cells that implement logic functions.
5. The integrated circuit of claim 1 , wherein the network is evenly distributed across the one of the plurality of layers to reduce skew of the test signals.
6. The integrated circuit of claim 1 , further comprising buffers distributed along the network in the one of the plurality of layers such that the distribution of the test signals is deterministic.
7. The integrated circuit of claim 6 , wherein the buffers comprise pre-characterized logic cells.
8. The integrated circuit of claim 6 , wherein the buffers are tied off when unused, and wherein buffers not needed for test signals distribution are powered down to reduce current leakage.
9. The integrated circuit of claim 6 , wherein the network is distributed symmetrically within each quadrant of the one of the plurality of layers.
10. The integrated circuit of claim 1 , wherein each of the quadrants comprise sub-quadrants and wherein the sub-networks branch into respective sub-quadrant from the center region of respective quadrants.
11. The integrated circuit of claim 10 , wherein network branches in each of the quadrants and sub-quadrants are mirror images of each other.
12. The integrated circuit of claim 1 , further comprising:
a test pin coupled to the center region of the one of the plurality of layers.
13. The integrated circuit of claim 1 , wherein the network is dedicated to routing the test signals.
14. The integrated circuit of claim 1 , further comprising:
multiple customizable layers coupled to the customizable layer.
15. The integrated circuit of claim 1 , wherein the network is device wide distribution for a clock signal.