System and method for self-aligned dual patterning

1. A method for self-aligned dual patterning, comprising:

forming a photo-resist layer above a device layer on a substrate;

patterning said photo-resist layer to form a photo-resist template mask having a first hardness;

treating said photo-resist template mask to form a hardened photo-resist template mask having a second hardness, wherein said second hardness is greater than said first hardness;

depositing a spacer-forming material layer over said hardened photo-resist template mask;

etching said spacer-forming material layer to form a spacer mask and to expose said hardened photo-resist template mask;

removing said hardened photo-resist template mask; and

transferring an image of said spacer mask to said device layer on said substrate.

2. The method of claim 1 , wherein treating said photo-resist template mask to form said hardened photo-resist template mask comprises exposing said photo-resist template mask to ultra-violet radiation to cure said photo-resist template mask.

3. The method of claim 2 , wherein the treating is carried out using a wavelength of light approximately in the range of 150-193 nanometers.

4. The method of claim 1 , wherein treating said photo-resist template mask to form said hardened photo-resist template mask comprises exposing said photo-resist template mask to a process selected from the group consisting of electron-beam curing, dopant implantation, and heating.

5. The method of claim 1 wherein patterning said photo-resist layer to form said photo-resist template mask comprises:

using a lithography exposure and development process to provide an as-developed photo-resist template mask; and

trimming said as-developed photo-resist template mask with an etch process.

6. The method of claim 1 wherein an amorphous carbon hard-mask layer is disposed above said device layer and below said photo-resist layer, and wherein said image of said spacer mask is transferred to said amorphous carbon hard-mask layer prior to transferring said image to said device layer.

7. A method for self-aligned dual patterning, comprising:

forming a patterned photo-resist layer on a layered structure;

introducing said layered structure to a platform supporting a plurality of process chambers;

trimming, in an etch process chamber coupled to said platform, said patterned photo-resist layer to provide a photo-resist template mask on said layered structure;

curing, in an ultra-violet radiation photo-resist curing process chamber coupled to said platform, said photo-resist template mask to form a hardened photo-resist template mask;

depositing a spacer-forming material layer over said hardened photo-resist template mask;

etching said spacer-forming material layer to form a spacer mask and to expose said hardened photo-resist template mask;

removing said hardened photo-resist template mask; and

transferring an image of said spacer mask to said layered structure.

8. The method of claim 7 , wherein both said etch process chamber and said ultra-violet radiation photo-resist curing process chamber are single-wafer process chambers.

9. The method of claim 8 wherein said platform is a Conductor Etch AdvantEdge™ platform.

10. The method of claim 7 , wherein depositing said spacer-forming material layer is carried out in a deposition process chamber coupled to said platform, and wherein etching said spacer-forming material is carried out in said etch process chamber.

11. The method of claim 7 , further comprising:

subsequent to trimming said patterned photo-resist layer to provide said photo-resist template mask and prior to curing said photo-resist template mask, measuring the critical dimension of said photo-resist template mask in an optical critical dimension metrology unit.

12. The method of claim 7 , wherein the curing is carried out using a wavelength of light approximately in the range of 150-193 nanometers.