Nonvolatile semiconductor memory device and method of manufacturing the same

1. A nonvolatile semiconductor memory device, comprising:

a plurality of first lines;

a plurality of second lines crossing said plurality of first lines;

a plurality of memory cells each connected at an intersection of said first and second lines between both lines and including a variable resistor operative to store information in accordance with a variation in resistance;

a protection film being a multi-layered film covering a side surface of said variable resistor; and

an interlayer-insulator film being buried between said memory cells arranged in a direction of extension of said first lines via said protection film,

wherein said protection film directly contacts an entire planar surface, said planar surface comprising a first side surface of said variable resistor of a first memory cell of said memory cells; a second side surface of said variable resistor of a second memory cell of said memory cells, said second memory cell being adjacent to said first memory cell in said direction; and a third side surface of said interlayer-insulator film, and said first, second, and third side surfaces being on the same side in a direction of extension of said second lines.

2. The nonvolatile semiconductor memory device according to claim 1 , wherein said protection film is composed of a material having a covalent bond.

3. The nonvolatile semiconductor memory device according to claim 1 , wherein said variable resistor comprises a binary metal oxide or a tertiary or higher metal oxide.

4. The nonvolatile semiconductor memory device according to claim 1 , wherein said protection film comprises an oxide film.

5. The nonvolatile semiconductor memory device according to claim 1 , wherein said protection film comprises a nitride film.

6. The nonvolatile semiconductor memory device according to claim 1 , wherein said protection film is formed separately on a memory cell basis in a direction of extension of said second lines.

7. The nonvolatile semiconductor memory device according to claim 1 , wherein:

each of said memory cells includes a metal layer on one of said first lines, a non-linear element on said metal layer, a first electrode on said non-linear element, said variable resistor on said first electrode, a second electrode on said variable resistor; and

said protection film is formed continuously on only side surfaces of said metal layer, said non-linear element, said first and second electrodes and said variable resistor of each of said two adjacent memory cells and on said first line.

8. The nonvolatile semiconductor memory device according to claim 1 , wherein said protection film has a continuous u-shape between said adjacent memory cells.