Diffusion variability control and transistor device sizing using threshold voltage implant
View Patent ↗A transistor is defined to include a substrate portion and a diffusion region defined in the substrate portion so as to provide an operable transistor threshold voltage. An implant region is defined within a portion of the diffusion region so as to transform the operable transistor threshold voltage of the diffusion region portion into an inoperably high transistor threshold voltage. A gate electrode is defined to extend over both the diffusion region and the implant region. A first portion of the gate electrode defined over the diffusion region forms a first transistor segment having the operable transistor threshold voltage. A second portion of the gate electrode defined over the implant region forms a second transistor segment having the inoperably high transistor threshold voltage. Therefore, a boundary of the implant region defines a boundary of the operable first transistor segment.
1. A transistor, comprising:
a substrate portion;
a diffusion region defined in the substrate portion to provide an operable transistor threshold voltage;
an implant region defined within a portion of the diffusion region so as to transform the operable transistor threshold voltage of the portion of the diffusion region into an inoperably high transistor threshold voltage; and
a gate electrode defined to extend over both the diffusion region and the implant region, such that a first portion of the gate electrode defined over the diffusion region forms a first transistor segment having the operable transistor threshold voltage, and such that a second portion of the gate electrode defined over the implant region forms a second transistor segment having the inoperably high transistor threshold voltage.
2. A transistor as recited in claim 1 , wherein a normal operating voltage associated with the gate electrode is greater than the operable transistor threshold voltage of the diffusion region and is less than the inoperably high transistor threshold voltage of the implant region, such that the first transistor segment is operable and the second transistor segment is inoperable in exposure of the gate electrode to the normal operating voltage.
3. A transistor as recited in claim 1 , wherein a boundary of the diffusion region defines a first width boundary of the first transistor segment, and wherein a boundary of the implant region defines a second width boundary of the first transistor segment, wherein a width of the first transistor segment extends between the first and second width boundaries.
4. A transistor as recited in claim 1 , wherein the diffusion region is defined from a rectangular-shaped layout area.
5. A transistor as recited in claim 1 , wherein the gate electrode is a linear-shaped gate electrode defined to extend over the substrate portion in a single direction.
6. A transistor as recited in claim 1 , wherein a boundary of the implant region that crosses the gate electrode is oriented to be substantially parallel to a channel length of the first transistor segment.
7. A transistor as recited in claim 1 , wherein the implant region is defined as a high voltage transistor implant region to provide a transistor threshold voltage of at least 2.5 volts, and wherein the operable transistor threshold voltage of the diffusion region is substantially less than 2.5 volts.
8. A transistor as recited in claim 1 , wherein the implant region represents a first implant region, and further comprising:
a second implant region defined within a second portion of the diffusion region so as to transform the operable transistor threshold voltage of the second portion of the diffusion region into the inoperably high transistor threshold voltage,
wherein the gate electrode is defined to extend over the first implant region, the diffusion region, and the second implant region, such that a third portion of the gate electrode defined over the second implant region forms a third transistor segment having the inoperably high transistor threshold voltage, and
wherein a boundary of the first implant region defines a first width boundary of the first transistor segment, and wherein a boundary of the second implant region defines a second width boundary of the first transistor segment, wherein a width of the first transistor segment extends between the first and second width boundaries.
9. A transistor as recited in claim 1 , wherein the transistor is defined on a semiconductor chip.
10. A method for designing a transistor, comprising:
specifying a diffusion region to be defined within a substrate so as to provide an operable transistor threshold voltage in the diffusion region;
specifying an implant region within a portion of the diffusion region so as to transform the operable transistor threshold voltage of the portion of the diffusion region into an inoperably high transistor threshold voltage; and
specifying a gate electrode to extend over both the diffusion region and the implant region, such that a first portion of the gate electrode defined over the diffusion region forms a first transistor segment having the operable threshold voltage, and such that a second portion of the gate electrode defined over the implant region forms a second transistor segment having the inoperably high transistor threshold voltage.
11. A method for designing a transistor as recited in claim 10 , wherein the implant region is specified such that a boundary of the implant region is positioned to cross the gate electrode at a desired transistor width boundary location of the first transistor segment.
12. A method for designing a transistor as recited in claim 10 , wherein the operable transistor threshold voltage is defined to be exceeded when a normal operating voltage is applied to the gate electrode, and wherein the inoperably high transistor threshold voltage is defined to not be exceeded when the normal operating voltage is applied to the gate electrode.
13. A method for designing a transistor as recited in claim 10 , wherein the diffusion region is specified as a rectangular-shaped layout area.
14. A method for designing a transistor as recited in claim 10 , wherein the implant region is positioned to redefine one or more boundaries of the diffusion region.
15. A method for designing a transistor as recited in claim 10 , wherein the implant region is positioned to eliminate misfabricated diffusion region boundaries.
16. A method for designing a transistor as recited in claim 10 , wherein the implant region represents a first implant region, and further comprising:
specifying a second implant region within a second portion of the diffusion region so as to transform the operable transistor threshold voltage of the second portion of the diffusion region into the inoperably high transistor threshold voltage,
wherein the gate electrode is specified to extend over both the first implant region, the diffusion region, and the second implant region, such that a third portion of the gate electrode defined over the second implant region forms a third transistor segment having the inoperably high transistor threshold voltage, and
wherein a boundary of the first implant region defines a first width boundary of the first transistor segment, and wherein a boundary of the second implant region defines a second width boundary of the first transistor segment, wherein a width of the first transistor segment extends between the first and second width boundaries.
17. A method for designing a transistor as recited in claim 16 , wherein specification of the first and second implant regions defines the width of the first transistor segment independently from a boundary of the diffusion region.
18. A semiconductor fabrication process, comprising:
forming a diffusion region in a substrate so as to provide an operable transistor threshold voltage;
forming an implant region over a portion of the diffusion region, wherein the implant region includes a dopant concentration sufficiently high so as to transform the operable transistor threshold voltage of the portion of the diffusion region into an inoperably high transistor threshold voltage; and
forming a gate electrode to extend over both the diffusion region and the implant region, whereby a first portion of the gate electrode defined over the diffusion region forms a first transistor segment having the operable transistor threshold voltage, and whereby a second portion of the gate electrode defined over the implant region forms a second transistor segment having the inoperably high transistor threshold voltage.
19. A semiconductor fabrication process as recited in claim 18 , wherein a normal operating voltage associated with the gate electrode is greater than the operable transistor threshold voltage provided by the diffusion region and is less than the inoperably high transistor threshold voltage of the implant region, such that the first transistor segment is operable and the second transistor segment is inoperable in exposure of the gate electrode to the normal operating voltage.
20. A semiconductor fabrication process as recited in claim 18 , wherein the diffusion region is formed such that a boundary of the diffusion region defines a first width boundary of the first transistor segment, and wherein the implant region is formed such that a boundary of the implant region defines a second width boundary of the first transistor segment, wherein a width of the first transistor segment extends between the first and second width boundaries.
21. A semiconductor fabrication process as recited in claim 18 , wherein the diffusion region is formed based on a rectangular-shaped diffusion region layout.
22. A semiconductor fabrication process as recited in claim 18 , wherein the gate electrode is a linear-shaped gate electrode defined to extend over the substrate portion in a single direction.
23. A semiconductor fabrication process as recited in claim 18 , wherein the implant region is formed such that a boundary of the implant region that crosses the gate electrode is oriented to be substantially parallel to a channel length of the first transistor segment.
24. A semiconductor fabrication process as recited in claim 18 , wherein the implant region is formed to adjust a shape of the diffusion region, whereby only portions of the diffusion region outside the implant region provide the operable transistor threshold voltage.
25. A semiconductor fabrication process as recited in claim 18 , wherein the implant region represents a first implant region, and further comprising:
forming a second implant region over a second portion of the diffusion region, wherein the second implant region includes a dopant concentration sufficiently high so as to transform the operable transistor threshold voltage into an inoperably high transistor threshold voltage within the second implant region,
wherein the gate electrode is formed to extend over the first implant region, the diffusion region, and the second implant region, such that a third portion of the gate electrode defined over the second implant region forms a third transistor segment having the inoperably high transistor threshold voltage, and
wherein a boundary of the first implant region defines a first width boundary of the first transistor segment, and wherein a boundary of the second implant region defines a second width boundary of the first transistor segment, wherein a width of the first transistor segment extends between the first and second width boundaries.
26. A semiconductor fabrication process as recited in claim 25 , wherein formation of the first and second implant regions defines a width of the first transistor segment independently from a boundary of the diffusion region.