IP Library Granted Patent US 8,253,125
Granted Patent B2
US 8,253,125 · App. 12/275,536 · Granted Aug 28, 2012

Semiconductor light emitting device and method of manufacturing the same

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Quick Facts
Patent No.
US 8,253,125
App. No.
12/275,536
Granted
Aug 28, 2012
Kind
B2
Abstract

There is provided a method of manufacturing a nitride semiconductor light emitting device. A method of manufacturing a nitride semiconductor light emitting device according to an aspect of the invention may include: nitriding a surface of an m-plane sapphire substrate; forming a high-temperature buffer layer on the m-plane sapphire substrate; depositing a semi-polar (11-22) plane nitride thin film on the high-temperature buffer layer; and forming a light emitting structure including a first nitride semiconductor layer, an active layer, and a second nitride semiconductor layer on the semi-polar (11-22) plane nitride thin film.

Claims (11)

1. A nitride semiconductor light emitting device comprising:

a nitrided m-plane sapphire substrate;

a high-temperature buffer layer provided directly on the nitrided m-plane sapphire substrate;

a semi-polar (11-22) plane nitride thin film provided directly on the high-temperature buffer layer; and

a light emitting structure including a first nitride semiconductor layer, an active layer, and a second nitride semiconductor layer on the semi-polar (11-22) plane nitride thin film, the first nitride semiconductor having an exposed portion, wherein the high-temperature buffer layer has a thickness within a range of 1000 to 4000 Å.

2. The nitride semiconductor light emitting device of claim 1 , wherein the nitrided m-plane sapphire substrate is nitrided within an optimum temperature range of 750 to 900° C.

3. The nitride semiconductor light emitting device of claim 1 , wherein the semi-polar (11-22) plane nitride thin film has a thickness of 2 to 3 μm.

4. The nitride semiconductor light emitting device of claim 1 , wherein the semi-polar (11-22) plane nitride thin film has a single crystal structure.

5. The nitride semiconductor light emitting device of claim 1 , further comprising:

a first electrode provided on the exposed portion of the first nitride semiconductor layer; and

a second electrode provided on the second nitride semiconductor layer.

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2009
From: PAEK, HO SUN; LEE, SUNG NAM; SAKONG, TAN; SUNG, YOUN JOON; HUR, IN HOE
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 022143/0539 →