Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line
A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.
1. A process for manufacturing an electronic module comprising a printed-circuit board, at least one first-type component and one second-type component, wherein the process comprises:
placing solder on the board;
putting the first-type component in a first position;
heating the entire board to melt the solder, resulting in soldering of the first-type component;
putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder; and
heating the solder locally to melt the solder such that the second-type component is soldered,
wherein heating the solder locally comprises applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes in order to heat each lead of the second-type component, wherein each of the two electrodes directly contacts each lead of the second-type component so as to make the electrical current flow between the two electrodes via the corresponding lead of the second-type component.
2. The process as claimed in claim 1 , wherein heating the entire board to melt the solder comprises passing the board through a reflow oven.
3. The process as claimed in claim 1 , in which a phase of adapting the soldering to the second-type component is carried out by modifying at least one of the parameters selected from a group consisting of a soldering profile, a current intensity curve for the electrodes, a mechanical pressure of the electrodes on the leads of the second-type component, a geometry of the electrodes, and a spacing and a positioning of the electrodes on the leads of the second-type component.
4. The process as claimed in claim 1 , in which the solder used for soldering the second-type component is placed on the circuit of the board at the same time as the solder used for soldering the first-type component.
5. The process as claimed in claim 1 , wherein the solder is a solder paste.
6. The process as claimed in claim 1 , further comprising:
depositing the solder on the leads of the second-type component prior to placing the second-type component into position.
7. The process as claimed in claim 1 , wherein putting the second-type component in position comprises:
placing the second-type component on top of the first-type component.