IP Library Granted Patent US 7,749,681
Granted Patent B2
US 7,749,681 · App. 12/282,599 · Granted Jul 6, 2010

Composition for forming lower layer film and pattern forming method

Assignee: JSR Corporation
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Quick Facts
Patent No.
US 7,749,681
App. No.
12/282,599
Granted
Jul 6, 2010
Kind
B2
Abstract

A composition for forming a lower layer film comprises a polymer (A) having a naphthalene derivative structural unit shown by the following formula (1), wherein R 1 represents a hydroxyl group and the like, X represents a substitutable alkylene group having 1 to 20 carbon atoms and the like, n represents 0 to 6, m represents 1 to 8, and n+m represents an integer from 1 to 8, provided that two or more R 1 s may be the same or different and two or more Xs may be the same or different.

Claims (14)

1. A composition for forming a lower layer film comprising a polymer(A), having a weight average molecular weight (Mw) of 500 to 8,000, and having a naphthalene derivative structural unit shown by the following formula (1),

wherein R1 represents a hydroxyl group, a substitutable alkyl group having 1 to 6 carbon atoms, a substitutable alkoxy group having 1 to 6 carbon atoms, a substitutable alkoxycarbonyl group having 2 to 10 carbon atoms, a substitutable aryl group having 6 to 14 carbon atoms, or a substitutable glycidyl ether group having 2 to 6 carbon atoms, n represents an integer from 0 to 6, X represents a methylene group, a substitutable alkylene group having 2 to 20 carbon atoms, a substitutable arylene group having 6 to 14 carbon atoms, or an alkylene ether group, and m represents an integer from 1 to 8, provided that two or more R1s may be the same or different when n is 2 to 6, two or more Xs may be the same or different when m is 2 to 8, and n +m is an integer from 1 to 8.

2. The composition for forming a lower layer film according to claim 1 , wherein R1 in the formula (1) has a structure shown by the following formula (2)

3. The composition for forming a lower layer film according to claim 2 , wherein X in the formula (1) has a structure shown by the following formula (3) and/or (4)

4. The composition for forming a lower layer film according to claim 3 , further comprising acid generating agent(C).

5. The composition for forming a lower layer film according to claim 3 , further comprising a cross-linking agent(D).

6. The composition for forming a lower layer film according to claim 3 , further comprising an additive(B) that prevents intermixing between the resist lower layer film and the resist film.

7. A pattern forming method comprising a step of forming a resist lower layer film by applying a composition for forming a lower layer film a polymer(A), having a weight average molecular weight (Mw) of 500 to 8,000, and having a naphthalene derivative structural unit shown by the following formula (1),

wherein R 1 represents a hydroxyl group, a substitutable alkyl group having 1 to 6 carbon atoms, a substitutable alkoxy group having 1 to 6 carbon atoms, a substitutable alkoxycarbonyl group having 2 to 10 carbon atoms, a substitutable aryl group having 6 to 14 carbon atoms, or a substitutable glycidyl ether group having 2 to 6 carbon atoms, n represents an integer from 0 to 6, X represents a methylene group, a substitutable alkylene group having 2 to 20 carbon atoms, a substitutable arylene group having 6 to 14 carbon atoms, or an alkylene ether group, and m represents an integer from 1 to 8, provided that two or more R 1 s may be the same or different when n is 2 to 6, two or more Xs may be the same or different when m is 2 to 8, and n +m is an integer from 1 to 8 to a substrate and curing the resulting coating film, a step of forming a resist film by applying a solution of a resist composition to the resist lower layer film and prebaking the resulting coating film, a step of selectively exposing the resist film through a photomask, a step of developing the exposed resist film, and a step of etching the resist lower layer film and the substrate.

8. The pattern forming method according to claim 7 , wherein R1 in the formula (1) has a structure shown by the following formula (2)

9. The pattern forming method according to claim 7 , wherein X in the formula (1) has a structure shown by the following formula (3) and/or (4)

10. The pattern forming method according to claim 7 , wherein the composition further comprises an acid generating agent(C).

11. The pattern forming method according to claim 7 , wherein the composition further comprising a cross-linking agent(D).

12. The pattern forming method according to claim 7 , wherein the composition further comprises an additive(B) that prevents intermixing between the resist lower layer film and the resist film.

Assignments (3)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2008
From: YOSHIMURA, NAKAATSU; KONNO, YOUSUKE; SUGITA, HIKARU; TAKAHASHI, JUNICHI
To: JSR CORPORATION
Reel/Frame 021830/0357 →
Priority Claims (1)
JP 2006-068525 · Mar 14, 2006 · national
Continuity (1)
Related Publication 20090098486A1 · Apr 16, 2009