IP Library › Granted Patent US 7,920,039
Granted Patent B2
US 7,920,039 · App. 12/284,934 · Granted Apr 5, 2011

Thermally enhanced magnetic transformer

Assignee: Flextronics AP, LLC
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Quick Facts
Patent No.
US 7,920,039
App. No.
12/284,934
Granted
Apr 5, 2011
Kind
B2
Abstract

A planar transformer comprises a laminate substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, a core configured to fit inside the opening to enclose the laminate substrate. At least one heat sink fin is integrally formed with the top, bottom or both sides of the core. A method of forming a planar transformer comprises laminating a substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, fitting a core inside the opening, and enclosing the laminate substrate. One of the top, bottom or both sides of the core include one or more heat sink fins.

Claims (35)

1. A planar transformer comprising:

a. a laminate substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding;

b. a core having a top core configured to fit inside and surround the opening and a bottom core to mount to the top core;

c. at least one heat sink fin, wherein the at least one heat sink fin is integrally formed on the top core; and

d. an uninterrupted and uniform heat conduction thermal path, wherein the thermal path extends from the top core to the at least one heat sink fin.

2. The planar transformer of claim 1 wherein the core comprises a ferrite ceramic.

3. The planar transformer of claim 1 wherein the core comprises iron.

4. The planar transformer of claim 1 wherein the core comprises a surface coating of a material having high thermal conductivity.

5. A planar transformer comprising:

a. a laminate substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding;

b. a core having a top core configured to fit inside and surround the opening and a bottom core to mount to the top core;

c. at least one heat sink fin, wherein the at least one heat sink fin is integrally formed on the bottom core; and

d. an uninterrupted and uniform heat conduction thermal path, wherein the thermal path extends from the bottom core to the at least one heat sink fin.

6. The planar transformer of claim 5 wherein the core comprises a ferrite ceramic.

7. The planar transformer of claim 5 wherein the core comprises iron.

8. The planar transformer of claim 5 wherein the core comprises a surface coating of a material having high thermal conductivity.

9. The planar transformer of claim 5 further comprising at least one heat sink fin, wherein the at least one heat sink fin is integrally formed on the top core.

10. A method of forming a planar transformer comprising:

a. laminating a substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding;

b. mounting a core to the transformer, the core having a top core configured to fit inside and surround the opening and a bottom core to mount to the top core, wherein the top core has at least one integrally formed heat sink fin; and

c. forming an uninterrupted and uniform heat conduction thermal path, wherein the thermal path extends from the top core to the at least one integrally formed heat sink fin.

11. The method of claim 10 wherein the core comprises a ferrite ceramic.

12. The method of claim 10 wherein the core comprises iron.

13. The method of claim 10 further comprising the step of coating a surface of the core with a material having high thermal conductivity.

14. A method of forming a planar transformer comprising:

a. laminating a substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding;

b. mounting a core to the transformer, the core having a top core configured to fit inside and surround the opening and a bottom core to mount to the top core, wherein the bottom core has at least one integrally formed heat sink fin; and

c. forming an uninterrupted and uniform heat conduction thermal path, wherein the thermal path extends from the bottom core to the at least one integrally formed heat sink fin.

15. The method of claim 14 wherein the core comprises a ferrite ceramic.

16. The method of claim 14 wherein the core comprises iron.

17. The planar transformer of claim 14 further comprising the step of coating a surface of the core with a material having high thermal conductivity.

18. The method of claim 14 further comprising at least one heat sink fin, wherein the at least one heat sink fin is integrally formed on the top core.

19. The planar transformer of claim 5 , wherein the heat sink fin couples to a component containing PCB.

20. The method of claim 10 further comprising forming the top core containing the at least one integrally formed heat sink fin in an extrusion process.

21. The method of claim 14 further comprising forming the bottom core containing the at least one integrally formed heat sink fin in an extrusion process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2008
From: SHABANY, YOUNES; AQUAYO, JUAN; RAO, SRINIVAS
To: FLEXTRONICS AP, LLC
Reel/Frame 021674/0725 →
Continuity (2)
Provisional Application 60995328 · Sep 25, 2007
Related Publication 20090079528A1 · Mar 26, 2009