Selective epitaxial growth method using halogen containing gate sidewall mask
View Patent ↗A semiconductor device in which selectivity in epitaxial growth is improved. There is provided a semiconductor device comprising a gate electrode formed over an Si substrate, which is a semiconductor substrate, with a gate insulating film therebetween and an insulating layer formed over sides of the gate electrode and containing a halogen element. With this semiconductor device, a silicon nitride film which contains the halogen element is formed over the sides of the gate electrode when an SiGe layer is formed over the Si substrate. Therefore, the SiGe layer epitaxial-grows over the Si substrate with high selectivity. As a result, an OFF-state leakage current which flows between, for example, the gate electrode and source/drain regions is suppressed and a manufacturing process suitable for actual mass production is established.
1. A method for fabricating a semiconductor device, the method comprising:
forming a gate electrode over a first semiconductor layer;
forming a first insulating film including a first halogen element over the gate electrode and the first semiconductor layer;
forming over the first insulating film a second insulating film including a second halogen element in which a content of the second halogen element is higher than a content of the first halogen element in the first insulating film;
removing a part of the first insulating film and a part of the second insulating film to expose the first semiconductor layer while remaining another part of the first insulating film and another part of the second insulating film over a side wall of the gate electrode;
after removing the part of the first insulating film and the part of the second insulating film, forming a recess region in the first semiconductor layer; and
forming a second semiconductor layer epitaxially in the recess region of the first semiconductor layer.
2. The method according to claim 1 , wherein the first halogen element and the second halogen element are one of chlorine and bromine.
3. The method according to claim 1 , wherein the first insulating film and the second insulating film are silicon nitride films.
4. The method according to claim 1 , wherein the second semiconductor layer is SiGe.
5. The method according to claim 1 , wherein the second insulating film is formed by a CVD method using gas including the second halogen element.
6. A method for fabricating a semiconductor device, the method comprising:
forming a gate electrode over a first semiconductor layer;
forming an insulating film which contains a halogen element over the gate electrode and the first semiconductor layer;
removing a part of the insulating film to expose the first semiconductor layer while remaining another part of the insulating film over a side wall of the gate electrode;
after removing the part of the insulating film, forming a recess region in the first semiconductor layer;
forming a second semiconductor layer epitaxially in the recess region of the first semiconductor layer,
wherein in forming the insulating film, a content of the halogen element in a surface portion of the insulating film is higher than a content of the halogen element in an inside of the insulating film, and
wherein the insulating film is formed by a CVD method using gas including the halogen element in which the surface portion of the insulating film is formed by increasing a content of the gas including the halogen element.
7. The method according to claim 6 , wherein the halogen element is one of chlorine and bromine.
8. The method according to claim 6 , wherein the insulating film is a silicon nitride film.
9. The method according to claim 6 , wherein the second semiconductor layer is SiGe.
10. The method according to claim 6 , wherein the halogen content of the insulating film over the side wall of the gate electrode has a gradient from the inside of the insulating film to the surface portion of the insulating film.