Arrangement with an assembly and a mounting rack
The invention relates to an arrangement with a mounting rack and at least one assembly provided with a housing encapsulation and mounted on the mounting rack, wherein the mounting rack and the assembly have contacting means which are thermally connected to each other. Suitable measures are provided with which the quality of the heat dissipation is identified at the correct time.
1. An arrangement for identifying a quality of a heat dissipation, comprising:
a mounting rack;
a contacting device arranged on the mounting rack;
an assembly provided with a housing encapsulation and mounted on the mounting rack;
a further contacting device arranged on the assembly and thermally connected to the contacting device of the mounting rack;
a heating element arranged on the assembly that increases a temperature in the housing encapsulation;
a temperature sensor arranged on the assembly that detects the temperature increase; and
an evaluation unit arranged on the assembly that checks a heat conduction between the contacting device and the further contacting device based on a thermal energy supplied by the heating element and the temperature increase.
2. The arrangement as claimed in claim 1 , wherein the contacting device and the further contacting device have planar surfaces.
3. The arrangement as claimed in claim 1 , wherein the contacting device and the further contacting device have surface-enlarging surfaces.
4. The arrangement as claimed in claim 1 , wherein the evaluation unit checks the heat conduction between the contacting device and the further contacting device periodically or in a predefined time.
5. An assembly provided with a housing encapsulation and mounted on a mounting rack, comprising:
a contacting device that is thermally connected to a further contacting device of the mounting rack;
a heating element that increases a temperature in the housing encapsulation;
a temperature sensor that detects the temperature increase; and
an evaluation unit that checks a heat conduction between the contacting device and the further contacting device based on a thermal energy supplied by the heating element and the temperature increase.
6. The assembly as claimed in claim 5 , wherein the contacting device and the further contacting device have planar surfaces.
7. The assembly as claimed in claim 5 , wherein the contacting device and the further contacting device have surface-enlarging surfaces.
8. The assembly as claimed in claim 5 , wherein the evaluation unit checks the heat conduction between the contacting device and the further contacting device periodically or in a predefined time.