Folded lead-frame packages for MEMS devices
The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least one MEMS device is attached to one of the substrates. The first pre-molded lead-frame substrate is folded over and joined to the second pre-molded lead-frame substrate to house the at least one MEMS device. In one embodiment, the first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of the cavities. The extended metal leads are folded over the top of the second pre-molded lead-frame substrate to form surface mounting pads. In some embodiments, extended metal leads are folded along the sidewalls and connected to ground for electromagnetic interference (EMI) shielding.
1. A MEMS package comprising:
a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery, wherein said first and second pre-molded lead-frame substrates are interconnected with metal leads; and
at least one MEMS device attached to one of said substrates wherein said first pre-molded lead-frame substrate is folded over and joined to said second pre-molded lead-frame substrate to house said at least one MEMS device.
2. The package according to claim 1 wherein said first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are trimmed and folded over the top of said second pre-molded lead-frame substrate to form surface mounting pads.
3. The package according to claim 1 wherein said first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are trimmed and folded along said side walls and connected to ground for electromigration shielding.
4. The package according to claim 1 wherein one of said metal leads has a through-hole therein extending through said metal lead and said pre-molded plastic substrate wherein an external signal can enter through said through-hole and reach said at least one MEMS device.
5. The package according to claim 1 wherein said at least one MEMS device is attached to said one of said pre-molded lead-frame substrates by adhesives.
6. The package according to claim 1 wherein said first pre-molded lead-frame substrate is joined to said second pre-molded lead-frame substrate by an adhesive paste or pre-cut adhesive film.
7. A MEMS package comprising:
a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery, wherein said first and second pre-molded lead-frame substrates are interconnected with metal leads; and
at least one MEMS device attached to one of said substrates wherein said substrate has a through-hole therein extending through said substrate wherein an external signal can enter through said through-hole and reach said at least one MEMS device and wherein said first pre-molded lead-frame substrate is folded over and joined to said second pre-molded lead-frame substrate to house said at least one MEMS device.
8. The package according to claim 7 wherein said first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are folded over the top of said second pre-molded lead-frame substrate to form surface mounting pads.
9. The package according to claim 7 wherein said first pre-molded lead-frame substrates has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are folded along said side walls and connected to ground for electromagnetic interference shielding.
10. The package according to claim 7 wherein said at least one MEMS device is attached to said one of said pre-molded lead-frame substrates by adhesives.
11. The package according to claim 7 wherein said first pre-molded lead-frame substrate is joined to said second pre-molded lead-frame substrate by an adhesive paste or a pre-cut adhesive film.
12. A MEMS package comprising:
a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery, wherein said first and second pre-molded lead-frame substrates are interconnected with metal leads; and
at least one MEMS device attached to one of said substrates wherein said first pre-molded lead-frame substrate is folded over and joined to said second pre-molded lead-frame substrate to house said at least one MEMS device and wherein said first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are trimmed and folded over the top of said second pre-molded lead-frame substrate to form surface mounting pads.
13. The package according to claim 12 wherein said first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are trimmed and folded along said side walls and connected to ground for electromigration shielding.
14. The package according to claim 12 wherein one of said metal leads has a through-hole therein extending through said metal lead and said pre-molded plastic substrate wherein an external signal can enter through said through-hole and reach said at least one MEMS device.
15. The package according to claim 12 wherein said at least one MEMS device is attached to said one of said pre-molded lead-frame substrates by adhesives.
16. The package according to claim 1 wherein said first pre-molded lead-frame substrate is joined to said second pre-molded lead-frame substrate by an adhesive paste or pre-cut adhesive film.