IP Library Granted Patent US 7,968,361
Granted Patent B2
US 7,968,361 · App. 12/295,206 · Granted Jun 28, 2011

GaN based semiconductor light emitting device and lamp

Assignee: Showa Denko K.K.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,968,361
App. No.
12/295,206
Granted
Jun 28, 2011
Kind
B2
Abstract

A method for producing a gallium nitride based compound semiconductor light emitting device which is excellent in terms of the light emitting properties and the light emission efficiency and a lamp is provided. In such a method for producing a gallium nitride based compound semiconductor light emitting device, which is a method for producing a GaN based semiconductor light emitting device having at least a buffer layer, an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer on a translucent substrate, on which an uneven pattern composed of a convex shape and a concave shape is formed, the buffer layer is formed by a sputtering method conducted in an apparatus having a pivoted magnetron magnetic circuit and the buffer layer contains AlN, ZnO, Mg, or Hf.

Claims (28)

1. A method for producing a GaN based semiconductor light emitting device having at least a buffer layer, an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer on a translucent substrate, the method comprising:

providing a translucent substrate having formed thereon an uneven pattern composed of a convex shape on an upper surface thereof;

wherein a height of the convex shape is 0.1 μm to 2 μm; and

forming the buffer layer by a sputtering method,

wherein the buffer layer is formed such that a lower surface and an upper surface of the buffer layer assume a shape of the uneven pattern of the upper surface of the translucent substrate, and a pattern of the lower and upper surfaces of the buffer layer is congruent with the uneven pattern of the upper surface of the translucent substrate, and

wherein a size of the convex shape satisfies the following relationship:

a diameter of a bottom of the convex shape or a length of a diagonal line of the convex shape is less than the height of the convex shape.

2. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the sputtering method is conducted in an apparatus having a pivoted magnetron magnetic circuit.

3. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the buffer layer comprises of AlN, ZnO, Mg, or Hf.

4. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the buffer layer comprises of AlN.

5. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the translucent substrate is a sapphire single crystal.

6. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the convex shape is a truncated cone and the height of the truncated cone is greater than the bottom diameter of the truncated cone.

7. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the convex shape is a truncated polygonal pyramid such as a truncated triangular pyramid, a truncated quadrangular pyramid, a truncated pentagonal pyramid, and a truncated hexagonal pyramid, or the height of the truncated polygonal pyramid is greater than a diagonal line of the bottom of the truncated polygonal pyramid.

8. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the convex shape is a circular cone and the height of the circular cone is greater than the bottom diameter of the circular cone.

9. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the convex shape is a polygonal pyramid such as a triangular pyramid, a quadrangular pyramid, a pentagonal pyramid, or a hexagonal pyramid, and the height of the polygonal pyramid is greater than a diagonal line of the bottom of the polygonal pyramid.

10. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the convex shape is a circular cylinder and a height of the circular cylinder is greater than the bottom diameter of the circular cylinder.

11. The method for producing a GaN based semiconductor light emitting device according to claim 1 ,

wherein the convex shape is a polygonal prism such as a triangular prism, a quadrangular prism, a pentagonal prism, or a hexagonal prism, and the height of the polygonal prism is greater than a diagonal line of the bottom of the polygonal prism.

12. The method for producing a GaN based semiconductor light emitting device according to claim 1 , wherein a lower surface of the n-type semiconductor layer abuts the upper surface of the buffer layer and assumes the shape of the upper surface of the buffer layer, and the substrate is a sapphire substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2008
From: OSAWA, HIROSHI; SHINOHARA, HIRONAO
To: SHOWA DENKO K.K.
Reel/Frame 021601/0810 →
Priority Claims (1)
JP 2006-096340 · Mar 31, 2006 · national
Continuity (1)
Related Publication 20090114933A1 · May 7, 2009