IP Library Granted Patent US 8,207,003
Granted Patent B2
US 8,207,003 · App. 12/297,989 · Granted Jun 26, 2012

Method of manufacturing gallium nitride-based compound semiconductor light-emitting device, gallium nitride-based compound semiconductor light-emitting device, and lamp

Assignee: Showa Denko K.K.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,207,003
App. No.
12/297,989
Granted
Jun 26, 2012
Kind
B2
Abstract

Provided are a method of manufacturing a gallium nitride-based compound semiconductor light-emitting device with a low driving voltage (Vf) and high light outcoupling efficiency, a gallium nitride-based compound semiconductor light-emitting device, and a lamp. In the method of manufacturing the gallium nitride-based compound semiconductor light-emitting device, a transparent conductive oxide film 15 including a dopant is laminated on a p-type semiconductor layer 14 of a gallium nitride-based compound semiconductor device 1 . The transparent conductive oxide film 15 is subjected to a laser annealing process using a laser after the lamination of the transparent conductive oxide film 15.

Claims (4)

1. A method of manufacturing a gallium nitride-based compound semiconductor light-emitting device, in which a transparent conductive oxide film including a dopant is laminated on a p-type semiconductor layer of a gallium nitride-based compound semiconductor device, the method comprising the step of subjecting the transparent conductive oxide film to a laser annealing process using an excimer laser, and the step of subjecting the transparent conductive oxide film to a thermal annealing process at a range of temperature of 200 to 250° C., wherein energy density of the excimer laser in the laser annealing process falls within a range of 150 to 300 mJcm −2 , the p-type semiconductor layer comprises Ga, and the transparent conductive oxide film contains Ga in a concentration of 20 atoms % or below at a location within 1 nm from the interface between the transparent conductive oxide film and the p-type semiconductor layer, and

the laser annealing process includes the step of forming unevenness on a surface of the transparent conductive oxide film using an excimer laser.

2. The method according to claim 1 , wherein the laser annealing process is performed using a KrF excimer laser or an ArF excimer laser as the excimer laser.

3. The method according to claim 1 , wherein the laser annealing process includes irradiating the transparent conductive oxide film with pulses within a range of 1 to 20 times using an excimer laser.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2008
From: FUKUNAGA, NAOKI; OSAWA, HIROSHI
To: SHOWA DENKO K.K.
Reel/Frame 021714/0907 →
Priority Claims (1)
JP 2006-119207 · Apr 24, 2006 · national
Continuity (1)
Related Publication 20090090922A1 · Apr 9, 2009