Transponder and method of producing a transponder
In a method of producing a transponder ( 1 ) an integrated circuit ( 2, 72, 82 ) is produced. The integrated circuit ( 2, 72, 82 ) is produced by applying a photoresist layer ( 11 ) on a surface ( 8 ) of a semiconductor device ( 4 ), generating a patterned mask ( 14 ) by lithographically patterning the photoresist layer ( 11 ) so that the photoresist layer ( 11 ) comprises at least one aperture ( 12, 13 ), and filling the aperture ( 12, 13 ) with a bump ( 15, 16, 75, 76 ) by depositing the bump ( 15, 16, 75, 76 ) on the surface ( 8 ) utilizing the patterned mask ( 14 ). Finally, the integrated circuit ( 2, 72, 82 ), with the patterned mask ( 14 ), is attached to a substrate ( 3 ), which comprises an antenna structure ( 18 ). The bump ( 15, 16, 75, 76 ) is connected electrically to the antenna structure ( 18 ).
1. A method of producing a transponder, comprising the steps of:
a) producing an integrated circuit by:
applying a photoresist layer to a surface of a semiconductor device,
generating a patterned mask by lithographically patterning said photoresist layer so that said photoresist layer comprises at least one aperture, and
filling said aperture with a bump by depositing said bump using a deposition process on said surface utilizing said patterned mask; and
b) attaching said integrated circuit with said patterned mask to a substrate, which comprises an antenna structure so that said bump is electrically connected to said antenna structure.
2. The method of claim 1 , comprising the step of depositing a gold bump on said surface.
3. The method of claim 1 , wherein said surface comprises a connection pad and said aperture matches said connection pad or is offset in respect to said connection pad.
4. The method of claim 1 , comprising the step of applying said photoresist layer having a predefined thickness (d).
5. The method of claim 1 , comprising the step of pressing said integrated circuit on said substrate when attaching said integrated circuit on said substrate.
6. The method of claim 1 , wherein said photoresist layer is a multi-component layer having adhesive characteristics in order to connect said integrated circuit to said substrate.
7. The method of claim 1 , wherein said bump extends a slight distance (D) above said patterned mask and/or overlaps said patterned mask.
8. A transponder, comprising:
an integrated circuit comprised of a semiconductor device, which comprises a surface, a patterned mask made from a photoresist layer applied on said surface, wherein said photoresist layer comprises at least one apertures filled with a deposited bump that is deposited using a deposition process; and
a substrate with an antenna structure, said integrated circuit being attached with said patterned mask to said substrate, wherein said bump electrically connects said antenna structure.
9. The transponder of claim 8 , wherein said bump is a gold bump.
10. The transponder of claim 8 , wherein said surface comprises a connection pad and said aperture matches said connection pad or is offset in respect to said connection pad.
11. The transponder of claim 8 , wherein said bump extends a slight distance (D) above said patterned mask and/or overlaps said patterned mask.
12. The transponder of claim 8 , wherein said photoresist layer is a multi-component layer having adhesive characteristics in order to connect said integrated circuit to said substrate and/or wherein said photoresist layer has a predetermined thickness (d).
13. A transponder, comprising:
an integrated circuit including
a semiconductor device having a surface and having at least one electrical circuit for communicating transponder signals;
a resistive layer portion disposed laterally on the surface and including an aperture through the resistive layer portion;
a conductive flash in the aperture with a portion of the flash extending laterally on the surface and immediately adjacent the aperture;
a deposition bump being configured and arranged on and electrically connected with the portion of the flash, and being offset laterally from the aperture; and
a substrate including an antenna structure, the substrate being attached to and configured and arranged with the integrated circuit and with the deposition bump for providing an electrical connection between the antenna structure and the integrated circuitry for communicatively passing the transponder signals.
14. The transponder of claim 13 , wherein the bump extends a slight distance above said resistive layer, and wherein the semiconductor device further includes a passivating material configured and arranged to provide the surface.
15. The transponder of claim 13 , wherein the flash is configured and arranged to electrically connect the deposition bump and the integrated circuit.
16. The transponder of claim 13 , wherein the at least one aperture is configured and arranged to provide a connection pathway for the deposition bump to the flash.
17. The transponder of claim 13 , wherein the bump includes gold.
18. The transponder of claim 13 , wherein the resistive layer is a multi-component layer having adhesive characteristics configured and arranged to connect said integrated circuit to said substrate.
19. The transponder of claim 13 , wherein the resistive layer is an acrylic based material including UV and thermal initiators.