Integrated circuit transponder, method of producing an integrated circuit and method of producing a transponder
In a method of producing an integrated circuit ( 1, 91, 131 ) for a transponder ( 2, 112 ) a photoresist layer ( 11 ) is applied on a first surface ( 8 ) of a semiconductor device ( 3 ). A patterned mask ( 14, 94 ) is generated by lithographically patterning the photoresist layer ( 11 ), so that the photoresist layer ( 11 ) comprises at least one first via ( 12, 13 ). The patterned mask ( 14, 94 ) comprises a second surface ( 17 ) facing away from the first surface ( 8 ). The first via ( 12, 13 ) is filled with a first bump ( 15, 16 ) by depositing the first bump ( 12, 13 ) on the first surface ( 8 ). A conductive structure ( 18, 19, 98, 99, 132 ) is formed on the second surface ( 17 ) of the patterned mask ( 14, 94 ). The conductive structure ( 18, 19, 98, 99, 132 ) is electrically connected to the first bump ( 15, 16 ).
1. A method of producing an integrated circuit for a transponder, the method comprising the steps of:
applying a photoresist layer on a first surface of a semiconductor device;
generating a patterned mask by lithographically patterning said photoresist layer, so that said photoresist layer comprises at least one first via, said patterned mask comprising a second surface facing away from said first surface;
filling said first via with a first bump by depositing said first bump on said first surface; and
after said first bump is deposited on said first surface, forming, on said second surface of said patterned mask on a non-via portion of said patterned mask, a conductive structure electrically connected to said first bump, wherein said first bump and said conductive structure are separate structures.
2. The method of claim 1 , comprising the step of depositing at least one second bump on said second surface of said patterned mask, said second bump being offset with respect to said first via and touching said conductive structure.
3. A method of producing a transponder, comprising the steps of:
producing an integrated circuit according to claim 2 ; and
attaching said integrated circuit with the second surface to a substrate which comprises an antenna structure, so that said antenna structure is electrically connected to said second bump.
4. The method of claim 1 , comprising the step of generating at least one second via in said photoresist layer, filling said second via with a second bump, and forming said conductive structure on said second surface of said patterned mask to electrically connect said first bump to said second bump.
5. A method of producing a transponder, the method comprising the steps of:
producing an integrated circuit according to claim 4 ;
attaching to a substrate comprising an antenna structure, said integrated circuit, so that said second surface faces away from said substrate; and
electrically connecting said antenna structure with said second bump.
6. The method of claim 1 , wherein said first bump is a gold bump and/or wherein said conductive structure is an antenna.
7. The method of claim 1 , wherein the first via is completely filled by the first bump.
8. The method of claim 1 , wherein said first bump is a gold bump.
9. The method of claim 1 , wherein forming, on said second surface of said patterned mask on the non-via portion of said patterned mask, the conductive structure comprises forming, on said second surface of said patterned mask on the non-via portion of said patterned mask, the conductive structure electrically connected to the non-via portion of said patterned mask and electrically connected to said first bump.
10. An integrated circuit for a transponder, comprising:
a semiconductor device, which comprises a first surface;
a patterned mask made of a photoresist layer and applied on said first surface, wherein said photoresist layer comprises at least one first via filled with a first bump deposited on said first surface, said patterned mask comprising a second surface facing away from said first surface; and
a conductive structure deposited on said second surface on a non-via portion of said patterned mask after said first bump is deposited on said first surface and electrically connected to said first bump, wherein said first bump and said conductive structure are separate structures.
11. The integrated circuit of claim 10 , comprising at least one second bump deposited on said second surface of said patterned mask, said second bump being offset with respect to said first via and touching said conductive structure.
12. A transponder, comprising:
said integrated circuit of claim 11 ; and
a substrate with an antenna structure, said substrate being attached to said second surface of said integrated circuit, so that said antenna structure is electrically connected to said second bump.
13. The integrated circuit of claim 10 , wherein said patterned mask comprises at least one second via filled with a second bump which is electrically connected to said first bump via said conductive structure.
14. A transponder, comprising:
said integrated circuit of claim 13 ;
a substrate comprising an antenna structure, said substrate being attached to said integrated circuit, so that said second surface faces away from said substrate; and
connections electrically connecting said antenna structure with said second bump.
15. The integrated circuit of claim 10 , wherein said first bump is a gold bump and/or wherein said conductive structure is an antenna.
16. The integrated circuit of claim 10 , wherein the first via is completely filled by the first bump.
17. The integrated circuit of claim 10 , wherein said first bump is a gold bump.
18. The integrated circuit of claim 10 , wherein the conductive structure is electrically connected to the non-via portion of said patterned mask and electrically connected to said first bump.