IP Library Granted Patent US 8,101,333
Granted Patent B2
US 8,101,333 · App. 12/311,725 · Granted Jan 24, 2012

Method for formation of miniaturized pattern and resist substrate treatment solution for use in the method

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Quick Facts
Patent No.
US 8,101,333
App. No.
12/311,725
Granted
Jan 24, 2012
Kind
B2
Abstract

The present invention provides a method for miniaturizing a pattern without seriously increasing the production cost or impairing the production efficiency. This invention also provides a fine resist pattern and a resist substrate-treating solution used for forming the fine pattern. The pattern formation method comprises a treatment step. In the treatment step, a resist pattern after development is treated with a resist substrate-treating solution containing an amino group-containing, preferably, a tertiary polyamine-containing water-soluble polymer, so as to reduce the effective size of the resist pattern formed by the development. The present invention also relates to a resist pattern formed by that method, and further relates to a treating solution used in the method.

Claims (15)

1. A pattern formation method for forming a fine resist pattern, comprising a step in which a resist pattern after development is treated with a resist substrate-treating solution containing an amino group-containing water-soluble polymer, so as to reduce the effective size of said resist pattern formed by the development, further where the water-soluble polymer is selected from a group consisting of poly-N-methylallylamine, poly-N,N′-dimethylallylamine and poly(N-methyl-3,5-piperidinediylmethylene.

2. The pattern formation method according to claim 1 wherein said resist pattern is treated with said resist substrate-treating solution for 10 to 300 seconds.

3. The pattern formation method according to claim 1 , characterized by further comprising the step of washing with pure water immediately before or after the treatment with said resist substrate-treating solution.

4. The pattern formation method according to claim 1 , wherein said resist pattern has a pattern dimension in which a line width of the line-and-space pattern or a hole diameter of the contact hole pattern is not more than 300 nm.

5. A fined resist pattern formed by the steps of: developing an imagewise exposed resist substrate with a developer, and then treating the developed resist substrate with a resist substrate-treating solution containing an amino group-containing water-soluble polymer, further where the water-soluble polymer is selected from a group consisting of poly-N-methylallylamine, poly-N,N′-dimethylallylamine and poly(N-methyl-3,5-piperidinediylmethylene.

6. A resist substrate-treating solution for reducing the effective size of a resist pattern, which comprises a solvent and an amino group-containing water-soluble polymer and with which a resist pattern formed by development is treated to reduce the effective size thereof, further where the water-soluble polymer is selected from a group consisting of poly-N-methylallylamine, poly-N,N′-dimethylallylamine and poly(N-methyl-3,5-piperidinediylmethylene.

7. The pattern formation method according to claim 1 , wherein the amino group-containing water-soluble polymer is poly-N-methylallylamine.

8. The pattern formation method according to claim 1 , wherein the amino group-containing water-soluble polymer is poly-N,N′-dimethylallylamine.

9. The pattern formation method according to claim 1 , wherein the amino group-containing water-soluble polymer is poly(N-methyl-3,5-piperidinediylmethylene).

10. The pattern formation method according to claim 5 , wherein the amino group-containing water-soluble polymer is poly-N-methylallylamine.

11. The pattern formation method according to claim 5 , wherein the amino group-containing water-soluble polymer is poly-N,N′-dimethylallylamine.

12. The pattern formation method according to claim 5 , wherein the amino group-containing water-soluble polymer is poly(N-methyl-3,5-piperidinediylmethylene).

13. The composition according to claim 6 , wherein the amino group-containing water-soluble polymer is poly-N-methylallylamine.

14. The composition according to claim 6 , wherein the amino group-containing water-soluble polymer is poly-N,N′-dimethylallylamine.

15. The composition according to claim 6 , wherein the amino group-containing water-soluble polymer is poly(N-methyl-3,5-piperidinediylmethylene).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2015
From: AZ ELECTRONIC MATERIALS USA CORP.
To: MERCK PATENT GMBH
Reel/Frame 034742/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2011
From: NOYA, GO; SHIMAZAKI, RYUTA; KOBAYASHI, MASAKAZU
To: AZ ELECTRONIC MATERIALS USA CORP.
Reel/Frame 026471/0759 →