Circuit board having power source
A circuit board having a power source is provided, including: a carrier board having a first dielectric layer disposed on at least a surface thereof and a first circuit layer disposed on the first dielectric layer, wherein the first circuit layer has at least an electrode pad; a first electrode plate disposed on the electrode pad; an insulating frame member disposed on the first electrode plate, with a portion of the first electrode plate being exposed from the insulating frame member, wherein electrolyte is received in the insulating frame member and in contact with the first electrode plate; and a porous second electrode plate disposed on the insulating frame member and the electrolyte, the second electrode plate being in contact with the electrolyte, so as to provide the power source for the circuit board.
1. A circuit board having a power source, comprising:
a carrier board having a first dielectric layer disposed on at least a surface thereof and a first circuit layer disposed on the first dielectric layer, wherein the first circuit layer has at least an electrode pad;
a first electrode plate disposed on the electrode pad;
an insulating frame member disposed on the first electrode plate, with a portion of the first electrode plate being exposed from the insulating frame member, wherein electrolyte is received in the insulating frame member and in contact with the first electrode plate; and
a porous second electrode plate disposed on the insulating frame member and the electrolyte, wherein the second electrode plate is in contact with the electrolyte.
2. The circuit board of claim 1 , further comprising:
a second dielectric layer disposed on the first dielectric layer, the first circuit layer and the second electrode plate, wherein the second dielectric layer has at least a cavity therein to expose the second electrode plate; and
a second circuit layer disposed on the second dielectric layer, wherein the second circuit layer has at least a first conductive pad, and at least a first conductive via and a second conductive via both disposed in the second dielectric layer and electrically connecting to the first circuit layer and the second electrode plate respectively.
3. The circuit board of claim 2 , further comprising a built-up circuit structure disposed on the second dielectric layer and the second circuit layer, the built-up circuit structure comprising a plurality of third conductive vias disposed therein and electrically connecting to the second circuit layer, and at least an opening corresponding to the cavity of the second dielectric layer.
4. The circuit board of claim 3 , wherein the built-up circuit structure further comprises at least a third dielectric layer and a third circuit layer stacked on the third dielectric layer, the third circuit layer having a plurality of second conductive pads, and wherein the plurality of third conductive vias are disposed in third dielectric layer and electrically connecting to the third circuit layer, and the built-up circuit structure is covered with an insulating protective layer having a plurality of openings therein to expose the second conductive pads.
5. The circuit board of claim 4 , further comprising conductive components disposed on the second conductive pads.
6. The circuit board of claim 5 , wherein the conductive components are electrically connected to a semiconductor chip by conductive bumps or bonding wires.
7. The circuit board of claim 1 , wherein the carrier board is one of an organic insulating board and an organic circuit board having inner circuit layers.
8. The circuit board of claim 1 , wherein the first electrode plate is made of one selected from the group consisting of zinc (Zn), aluminum (Al) and magnesium (Mg), and is electrically conductive as well as reactive with the electrolyte so as to provide a source of hydrogen.
9. The circuit board of claim 1 , wherein the electrolyte is an OH — -containing alkaline solution selected from the group consisting of hydrogen peroxide (H 2 O 2 ), sodium hydroxide (NaOH) and potassium hydroxide (KOH).
10. The circuit board of claim 1 , wherein the insulating frame member comprises a pore-free insulating resin resistant to acid and alkali.
11. The circuit board of claim 1 , wherein the insulating frame member comprises a mixture of organic and inorganic materials.
12. The circuit board of claim 1 , wherein the insulating frame member is round, rectangular, or polygonal.
13. The circuit board of claim 1 , wherein the second electrode plate is a porous metal board.
14. The circuit board of claim 1 , wherein the second electrode plate is a porous insulating board, and a metal film is disposed on surfaces of pores of the porous insulating board.
15. The circuit board of claim 14 , wherein the porous insulating board is made of aluminum oxide (Al 2 O 3 ).
16. The circuit board of claim 14 , wherein the metal film is made of one selected from the group consisting of copper (Cu), platinum (Pt), nickel (Ni) and gold (Au).