IP Library Patent Application 12314208
Patent Application
App. No. 12/314,208

Exposure system and pattern formation method

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Quick Facts
Patent No.
US None
App. No.
12/314,208
Abstract

An exposure system includes an exposure section provided within a chamber for irradiating a resist film formed on a wafer with exposing light through a mask with an immersion liquid provided on the resist film. It further includes a drying section for drying the surface of the resist film after the irradiation.

Claims (23)

1 - 27 . (canceled)

28 . An exposure system comprising:

an exposure section for irradiating a formed resist film with exposing light through a mask with an immersion liquid provided on said resist film; and

a drying section for drying a surface of said resist film after irradiation,

wherein said drying section includes air blowing means for blowing air against said resist film, and an exhaust section communicated with an exhaust port for discharging air to the outside of a chamber.

29 . An exposure system comprising:

an exposure section for irradiating a formed resist film with exposing light through a mask with an immersion liquid provided on said resist film; and

a drying section for drying a surface of said resist film after irradiation,

wherein said drying section includes a dehumidification vessel dehumidified by dehumidification means.

30 . An exposure system comprising:

an exposure section for irradiating a formed resist film with exposing light through a mask with an immersion liquid provided on said resist film; and

a drying section for drying a surface of said resist film after irradiation,

wherein said drying section includes a warming vessel warmed by warming means.

31 . The exposure system of claim 28 ,

wherein said resist film is formed on a wafer, and

said drying section dries a whole top surface of said wafer.

32 . The exposure system of claim 31 ,

wherein said exposure section includes twin stages having at least two wafer placing portions, and

the whole top surface of said wafer is dried on one of said wafer placing portions of said twin stages.

33 . The exposure system of claim 28 , wherein said air blowing means is an air fan capable of blowing warm air.

34 . The exposure system of claim 29 , wherein said dehumidification means is a dehumidification apparatus for lowering humidity of said dehumidification vessel by using a refrigerant.

35 . The exposure system of claim 29 , wherein said dehumidification means is a drying agent for lowering humidity of said dehumidification vessel.

36 . The exposure system of claim 30 , wherein said warming means is a warming apparatus for warming said warming vessel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2013
From: PANASONIC CORPORATION
To: RPX CORPORATION
Reel/Frame 029756/0053 →